SNVSCD0C November   2023  – December 2024 LP5810

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Dimming
      2. 7.3.2 PWM Dimming
      3. 7.3.3 Autonomous Animation Engine Control
        1. 7.3.3.1 Animation Engine Pattern
        2. 7.3.3.2 Sloper
        3. 7.3.3.3 Animation Engine Unit (AEU)
        4. 7.3.3.4 Animation Pause Unit (APU)
      4. 7.3.4 Protections and Diagnostics
        1. 7.3.4.1 LED Open Detections
        2. 7.3.4.2 LED Short Detections
        3. 7.3.4.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Data Transactions
      2. 7.5.2 I2C Data Format
  9. 8 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Parameters
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Input Capacitor Selection
        2. 9.2.3.2 Program Procedure
        3. 9.2.3.3 Programming Example
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions


LP5810 LP5810 YBH Package 9-Pin DSBGA Top View

Figure 5-1 LP5810 YBH Package 9-Pin DSBGA Top View

LP5810 LP5810 DSD Package 8-Pin WSON Top View

Figure 5-2 LP5810 DSD Package 8-Pin WSON Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME YBH DSD
OUT0 A1 8 O Output 0 which contains current sink 0 and high-side scan FET 0. If not used, this pin must be floating.
GND A2

Thermal

Pad

 G Ground. Must be connected to the common ground plane
VCC A3 1 P Boost converter output. A 22 uF capacitor is recommended to be connected between this pin with GND and be placed as close to the device as possible.
OUT1 B1 7 O Output 1 which contains current sink 1 and high-side scan FET 1. If not used, this pin must be floating.
SYNC B2 2 I/O Synchronous between multiple devices. If not used, this pin can be connected to ground to save power.
SCL B3 3 I I2C serial interface clock input.
OUT2 C1 6 O Output 2 which contains current sink 2 and high-side scan FET 2. If not used, this pin must be floating.
OUT3 C2 5 O Output 3 which contains current sink 3 and high-side scan FET 3. If not used, this pin must be floating.
SDA C3 4 I/O I2C serial interface data input/output.
(1) P: Power Pin; I: Input Pin; I/O: Input/Output Pin; O: Output Pin.