SNVSCD0C November   2023  – December 2024 LP5810

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Dimming
      2. 7.3.2 PWM Dimming
      3. 7.3.3 Autonomous Animation Engine Control
        1. 7.3.3.1 Animation Engine Pattern
        2. 7.3.3.2 Sloper
        3. 7.3.3.3 Animation Engine Unit (AEU)
        4. 7.3.3.4 Animation Pause Unit (APU)
      4. 7.3.4 Protections and Diagnostics
        1. 7.3.4.1 LED Open Detections
        2. 7.3.4.2 LED Short Detections
        3. 7.3.4.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Data Transactions
      2. 7.5.2 I2C Data Format
  9. 8 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Parameters
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Input Capacitor Selection
        2. 9.2.3.2 Program Procedure
        3. 9.2.3.3 Programming Example
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

The input capacitor needs not only to be close to the VCC pin, but also to the GND pin in order to reduce input supply ripple. For OUTx (x = 0, 1, 2, 3), low inductive and resistive path of switch load loop can help to provide a high slew rate. Therefore, path of adjecent outputs must be short and wide and avoid parallel wiring and narrow trace. For better thermal performance, TI suggest to make copper polygon connected with each pin bigger.