SNVSCC9B November   2023  – December 2024 LP5812

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Cross-Multiplexing (TCM) Scheme
        1. 7.3.1.1 Direct drive mode
        2. 7.3.1.2 TCM Drive Mode
        3. 7.3.1.3 Mix drive mode
        4. 7.3.1.4 Ghosting Elimination
      2. 7.3.2 Analog Dimming
      3. 7.3.3 PWM Dimming
      4. 7.3.4 Autonomous Animation Engine Control
        1. 7.3.4.1 Animation Engine Pattern
        2. 7.3.4.2 Sloper
        3. 7.3.4.3 Animation Engine Unit (AEU)
        4. 7.3.4.4 Animation Pause Unit (APU)
      5. 7.3.5 Protections and Diagnostics
        1. 7.3.5.1 LED Open Detections
        2. 7.3.5.2 LED Short Detections
        3. 7.3.5.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Input Capacitor Selection
        2. 8.2.3.2 Program Procedure
        3. 8.2.3.3 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
  • DSD|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (August 2024) to Revision B (December 2024)

  • Added Pin Configuration SectionGo
  • Removed EN on parameter from Reccomended Operating Conditions Table Go
  • Removed VEN_H and VEN_L on parameter from Electrical Characteristics Table Go
  • Changed Program ProcedureGo
  • Changed Program ExampleGo

Changes from Revision * (September 2023) to Revision A (August 2024)

  • Added WCSP packageGo
  • Updated Electrical Specifications Table Go
  • Added DRR (WSON) Thermal InformationGo
  • Updated Electrical Specifications Table Go
  • Added Programming ExampleGo