SNVSC36A December   2021  – September 2024 LP5866

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7.     14
    8. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
      3. 7.3.3 PWM Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Recommendations
      2. 8.3.2 Power Supply Recommendations
      3. 8.3.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.3 Detailed Design Procedure

LP5866 requires an external capacitor CVCAP, whose value is 1μF connected from VCAP to GND for proper operation of internal LDO. The capacitor must be placed as close to the device as possible.

TI recommends 1μF capacitors be placed between VCC / VLED with GND, and a 1nF capacitor placed between VIO with GND. Place the capacitors as close to the device as possible.

Pull-up resistors Rpull-up are a requirement for SCL and SDA when using I2C as communication method. In typical applications, TI recommends 1.8kΩ to 4.7kΩ resistors.

To decrease thermal dissipation from device to ambient, resistors RCS can optionally be placed in serial with the LED. Voltage drop on these resistors must left enough margins for VSAT to ensure the device works normally.