SNVSC36A December   2021  – September 2024 LP5866

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7.     14
    8. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
      3. 7.3.3 PWM Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Recommendations
      2. 8.3.2 Power Supply Recommendations
      3. 8.3.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

Electronic devices are becoming smarter, requiring to use larger quantity of LEDs for animation and indication purpose. A high-performance LED matrix driver is required to improve user experience with small solution size.

The LP586x devices are a family of high performance LED matrix drivers. The device integrates 18 constant current sinks with N (N = 1/2/4/6/8/11) switching MOSFETs to support N × 18 LED dots or N × 6 RGB LEDs. The LP5866 integrates 6 MOSFETs for up to 108 LED dots or 36 RGB LEDs.

The LP5866 supports both analog dimming and PWM dimming methods. For analog dimming, each LED dot can be adjusted with 256 steps. For PWM dimming, the integrated 8-bit or 16-bit configurable PWM generators enable smooth and audible-noise-free dimming control. Each LED dot can also be arbitrarily mapped into 8-bit group PWM to achieve dimming control together.

The LP5866 device implements full addressable SRAM to minimize the data traffic. The ghost-cancellation circuitry is integrated to eliminate both upside and downside ghosting. The LP5866 also supports LED open and short detection functions. Both 1MHz (maximum) I2C and 12MHz (maximum) SPI are available in LP5866.

Device Information
PART NUMBERPACKAGE(1)BODY SIZE (NOM)
LP5866VQFN (40)5.00mm × 5.00mm
TSSOP (38) 9.70mm × 4.40mm
For all available packages, see the orderable addendum at the end of the data sheet.
LP5866 Simplified Schematic Simplified Schematic