SLVSGD5 July   2021 LP5890

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Independent and Stackable Mode
        1. 8.3.1.1 Independent Mode
        2. 8.3.1.2 Stackable Mode
      2. 8.3.2 Current Setting
        1. 8.3.2.1 Brightness Control (BC) Function
        2. 8.3.2.2 Color Brightness Control (CC) Function
        3. 8.3.2.3 Choosing BC/CC for a Different Application
      3. 8.3.3 Frequency Multiplier
      4. 8.3.4 Line Transitioning Sequence
      5. 8.3.5 Protections and Diagnostics
        1. 8.3.5.1 Thermal Shutdown Protection
        2. 8.3.5.2 IREF Resistor Short Protection
        3. 8.3.5.3 LED Open Load Detection and Removal
          1. 8.3.5.3.1 LED Open Detection
          2. 8.3.5.3.2 Read LED Open Information
          3. 8.3.5.3.3 LED Open Caterpillar Removal
        4. 8.3.5.4 LED Short and Weak Short Circuitry Detection and Removal
          1. 8.3.5.4.1 LED Short and Weak Short Detection
          2. 8.3.5.4.2 Read LED Short Information
          3. 8.3.5.4.3 LSD Caterpillar Removal
    4. 8.4 Device Functional Modes
    5. 8.5 Continuous Clock Series Interface
      1. 8.5.1 Data Validity
      2. 8.5.2 CCSI Frame Format
      3. 8.5.3 Write Command
        1. 8.5.3.1 Chip Index Write Command
        2. 8.5.3.2 VSYNC Write Command
        3. 8.5.3.3 Soft_Reset Command
        4. 8.5.3.4 Data Write Command
      4. 8.5.4 Read Command
    6. 8.6 PWM Grayscale Control
      1. 8.6.1 Grayscale Data Storage and Display
        1. 8.6.1.1 Memory Structure Overview
        2. 8.6.1.2 Details of Memory Bank
        3. 8.6.1.3 Write a Frame Data into Memory Bank
      2. 8.6.2 PWM Control for Display
    7. 8.7 Register Maps
      1. 8.7.1  FC0
      2. 8.7.2  FC1
      3. 8.7.3  FC2
      4. 8.7.4  FC3
      5. 8.7.5  FC4
      6. 8.7.6  FC10
      7. 8.7.7  FC11
      8. 8.7.8  FC12
      9. 8.7.9  FC13
      10. 8.7.10 FC14
      11. 8.7.11 FC15
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 System Structure
        2. 9.2.1.2 SCLK Frequency
        3. 9.2.1.3 Internal GCLK Frequency
        4. 9.2.1.4 Line Switch Time
        5. 9.2.1.5 Blank Time Removal
        6. 9.2.1.6 BC and CC
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Chip Index Command
        2. 9.2.2.2 FC Registers Settings
        3. 9.2.2.3 Grayscale Data Write
        4. 9.2.2.4 VSYNC Command
        5. 9.2.2.5 LED Open and Short Read
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.2 Layout Example

In order to simplify the system power rails design, we suggest that VR, VCC use one power rail, and VG, VB use another power rail. Figure 11-1 gives an example for power rails routing.

Connect the GND pin to thermal pad on board with the shortest wire and the thermal pad is connected to GND plane with the vias, as many as possible to help the power dissipation.

GUID-23F0FC4A-5ABC-4523-AA31-7F5394E0EDC3-low.gifFigure 11-1 Power Rails Routing Suggestion

Figure 11-2 gives an example for line routing. Connect the line switch to the center of the line bus, so as to uniform the current flowing from the line switch to the left side and right side LEDs in white grayscale. With this connection, the unbalance of the parasitic inductor from the routing will be the smallest and the display performance will be better, especially in low grayscale condition.

GUID-20210723-CA0I-7NDR-GD3G-GMTJPJ0Z64ZM-low.gif Figure 11-2 Line Routing Suggestion

Figure 11-3 gives an example for channel routing with the shortest wire. With this connection, the channel to the LED path is the shortest, which can reduce the wire inductance, and be a benefit to the performance. However, the data transmission sequence should be adjusted to follow the pins routing map. For example, R0 connects to column 15 (LED15 ). The first data should be column 15 (LED15) rather than column 0 (LED0).

GUID-20210723-CA0I-L8DG-TPRB-HKC4H7SB2L7L-low.gif Figure 11-3 Channel Routing Suggestion with Shortest Wire

Figure 11-4 gives an example for channel routing with pin number sequence. With this connection, the data transmission sequence will be the same with pin number sequence. For example, R0 connects to column 0 (LED0 ). The first data will be column 0 (LED0). However, with this connection, the inductance for each channel may be different, which might bring a slight difference for the worst case.

GUID-20210723-CA0I-FHBP-STH0-GR8MFSSLPTH0-low.gif Figure 11-4 Channel Routing Suggestion with Channel Order Sequence