SNVS673E
April 2010 – September 2014
LP8551
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Device Default Values
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
Handling Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Boost Converter Electrical Characteristics
7.7
LED Driver Electrical Characteristics
7.8
PWM Interface Characteristics
7.9
Undervoltage Protection
7.10
Logic Interface Characteristics
7.11
I2C Serial Bus Timing Parameters (SDA, SCLK)
7.12
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Clock Generation
8.3.2
Brightness Control Methods
8.3.2.1
PWM Input Duty Cycle
8.3.2.2
Brightness Register Control
8.3.2.3
PWM Direct Control
8.3.2.4
PWM Calculation Data Flow
8.3.2.5
PWM Detector
8.3.2.6
Brightness Control
8.3.2.7
Resolution Selector
8.3.2.8
Sloper
8.3.2.9
PWM Comparator
8.3.2.10
Current Setting
8.3.2.11
PWM Frequency Setting
8.3.2.12
Phase Shift PWM (PSPWM) Scheme
8.3.2.13
Slope
8.3.2.14
Driver Headroom Control
8.3.3
Boost Converter
8.3.3.1
Operation
8.3.3.2
Protection
8.3.3.3
Manual Output Voltage Control
8.3.3.4
Adaptive Boost Control
8.3.4
Fault Detection
8.3.4.1
LED Fault Detection
8.3.4.2
Undervoltage Detection
8.3.4.3
Overcurrent Protection
8.3.4.4
Device Thermal Regulation
8.3.4.5
Thermal Shutdown
8.4
Device Functional Modes
8.4.1
Modes of Operation
8.5
Programming
8.5.1
I2C-Compatible Serial Bus Interface
8.5.1.1
Interface Bus Overview
8.5.1.2
Data Transactions
8.5.1.3
Acknowledge Cycle
8.5.1.4
“Acknowledge After Every Byte” Rule
8.5.1.5
Addressing Transfer Formats
8.5.1.6
Control Register Write Cycle
8.5.1.7
Control Register Read Cycle
8.5.1.8
Register Read and Write Detail
8.5.2
EEPROM
8.6
Register Map
8.6.1
Register Bit Explanations
8.6.1.1
Brightness Control
8.6.1.2
Device Control
8.6.1.3
Fault
8.6.1.4
Identification
8.6.1.5
Direct Control
8.6.1.6
Temp MSB
8.6.1.7
Temp LSB
8.6.1.8
EEPROM Control
8.6.2
EEPROM Bit Explanations
8.6.2.1
EEPROM Register Map
8.6.2.2
EEPROM Address 0
8.6.2.3
EEPROM Address 1
8.6.2.4
EEPROM Address 2
8.6.2.5
EEPROM Address 3
8.6.2.6
EEPROM Address 4
8.6.2.7
EEPROM Address 5
8.6.2.8
EEPROM Address 7
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Application Using Internal LDO
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Recommended External Components
9.2.1.2.1.1
Inductor Selection
9.2.1.2.1.2
Output Capacitor
9.2.1.2.1.3
LDO Capacitor
9.2.1.2.1.4
Output Diode
9.2.1.3
Application Curves
9.2.2
Application with Low-Input Voltage
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Trademarks
12.2
Electrostatic Discharge Caution
12.3
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YZR|25
MXBG279
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snvs673e_oa
snvs673e_pm
5 Device Default Values
Table 1. Default EEPROM Memory Values
ADDRESS
DEFAULT VALUES LP8551
A0H
0111 1111
A1H
1011 0101
A2H
1010 1110
A3H
0111 1011
A4H
0010 0000
A5H
0000 1001
A6H
0000 0000
A7H
0000 0101