SNVSAW2B April   2017  – December 2018 LP87524B-Q1 , LP87524J-Q1 , LP87524P-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1 DC-DC Converters
        1. 7.3.1.1 Overview
        2. 7.3.1.2 Transition Between PWM and PFM Modes
        3. 7.3.1.3 Buck Converter Load-Current Measurement
        4. 7.3.1.4 Spread-Spectrum Mode
      2. 7.3.2 Sync Clock Functionality
      3. 7.3.3 Power-Up
      4. 7.3.4 Regulator Control
        1. 7.3.4.1 Enabling and Disabling Regulators
        2. 7.3.4.2 Changing Output Voltage
      5. 7.3.5 Enable and Disable Sequences
      6. 7.3.6 Device Reset Scenarios
      7. 7.3.7 Diagnostics and Protection Features
        1. 7.3.7.1 Power-Good Information (PGOOD pin)
        2. 7.3.7.2 Warnings for Diagnostics (Interrupt)
          1. 7.3.7.2.1 Output Power Limit
          2. 7.3.7.2.2 Thermal Warning
        3. 7.3.7.3 Protection (Regulator Disable)
          1. 7.3.7.3.1 Short-Circuit and Overload Protection
          2. 7.3.7.3.2 Overvoltage Protection
          3. 7.3.7.3.3 Thermal Shutdown
        4. 7.3.7.4 Fault (Power Down)
          1. 7.3.7.4.1 Undervoltage Lockout
      8. 7.3.8 GPIO Signal Operation
      9. 7.3.9 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  OTP_REV
          1. Table 10. OTP_REV Register Field Descriptions
        2. 7.6.1.2  BUCK0_CTRL1
          1. Table 11. BUCK0_CTRL1 Register Field Descriptions
        3. 7.6.1.3  BUCK1_CTRL1
          1. Table 12. BUCK1_CTRL1 Register Field Descriptions
        4. 7.6.1.4  BUCK2_CTRL1
          1. Table 13. BUCK2_CTRL1 Register Field Descriptions
        5. 7.6.1.5  BUCK3_CTRL1
          1. Table 14. BUCK3_CTRL1 Register Field Descriptions
        6. 7.6.1.6  BUCK0_VOUT
          1. Table 15. BUCK0_VOUT Register Field Descriptions
        7. 7.6.1.7  BUCK0_FLOOR_VOUT
          1. Table 16. BUCK0_FLOOR_VOUT Register Field Descriptions
        8. 7.6.1.8  BUCK1_VOUT
          1. Table 17. BUCK1_VOUT Register Field Descriptions
        9. 7.6.1.9  BUCK1_FLOOR_VOUT
          1. Table 18. BUCK1_FLOOR_VOUT Register Field Descriptions
        10. 7.6.1.10 BUCK2_VOUT
          1. Table 19. BUCK2_VOUT Register Field Descriptions
        11. 7.6.1.11 BUCK2_FLOOR_VOUT
          1. Table 20. BUCK2_FLOOR_VOUT Register Field Descriptions
        12. 7.6.1.12 BUCK3_VOUT
          1. Table 21. BUCK3_VOUT Register Field Descriptions
        13. 7.6.1.13 BUCK3_FLOOR_VOUT
          1. Table 22. BUCK3_FLOOR_VOUT Register Field Descriptions
        14. 7.6.1.14 BUCK0_DELAY
          1. Table 23. BUCK0_DELAY Register Field Descriptions
        15. 7.6.1.15 BUCK1_DELAY
          1. Table 24. BUCK1_DELAY Register Field Descriptions
        16. 7.6.1.16 BUCK2_DELAY
          1. Table 25. BUCK2_DELAY Register Field Descriptions
        17. 7.6.1.17 BUCK3_DELAY
          1. Table 26. BUCK3_DELAY Register Field Descriptions
        18. 7.6.1.18 GPIO2_DELAY
          1. Table 27. GPIO2_DELAY Register Field Descriptions
        19. 7.6.1.19 GPIO3_DELAY
          1. Table 28. GPIO3_DELAY Register Field Descriptions
        20. 7.6.1.20 RESET
          1. Table 29. RESET Register Field Descriptions
        21. 7.6.1.21 CONFIG
          1. Table 30. CONFIG Register Field Descriptions
        22. 7.6.1.22 INT_TOP1
          1. Table 31. INT_TOP1 Register Field Descriptions
        23. 7.6.1.23 INT_TOP2
          1. Table 32. INT_TOP2 Register Field Descriptions
        24. 7.6.1.24 INT_BUCK_0_1
          1. Table 33. INT_BUCK_0_1 Register Field Descriptions
        25. 7.6.1.25 INT_BUCK_2_3
          1. Table 34. INT_BUCK_2_3 Register Field Descriptions
        26. 7.6.1.26 TOP_STAT
          1. Table 35. TOP_STAT Register Field Descriptions
        27. 7.6.1.27 BUCK_0_1_STAT
          1. Table 36. BUCK_0_1_STAT Register Field Descriptions
        28. 7.6.1.28 BUCK_2_3_STAT
          1. Table 37. BUCK_2_3_STAT Register Field Descriptions
        29. 7.6.1.29 TOP_MASK1
          1. Table 38. TOP_MASK1 Register Field Descriptions
        30. 7.6.1.30 TOP_MASK2
          1. Table 39. TOP_MASK2 Register Field Descriptions
        31. 7.6.1.31 BUCK_0_1_MASK
          1. Table 40. BUCK_0_1_MASK Register Field Descriptions
        32. 7.6.1.32 BUCK_2_3_MASK
          1. Table 41. BUCK_2_3_MASK Register Field Descriptions
        33. 7.6.1.33 SEL_I_LOAD
          1. Table 42. SEL_I_LOAD Register Field Descriptions
        34. 7.6.1.34 I_LOAD_2
          1. Table 43. I_LOAD_2 Register Field Descriptions
        35. 7.6.1.35 I_LOAD_1
          1. Table 44. I_LOAD_1 Register Field Descriptions
        36. 7.6.1.36 PGOOD_CTRL1
          1. Table 45. PGOOD_CTRL1 Register Field Descriptions
        37. 7.6.1.37 PGOOD_CTRL2
          1. Table 46. PGOOD_CTRL2 Register Field Descriptions
        38. 7.6.1.38 PGOOD_FLT
          1. Table 47. PGOOD_FLT Register Field Descriptions
        39. 7.6.1.39 PLL_CTRL
          1. Table 48. PLL_CTRL Register Field Descriptions
        40. 7.6.1.40 PIN_FUNCTION
          1. Table 49. PIN_FUNCTION Register Field Descriptions
        41. 7.6.1.41 GPIO_CONFIG
          1. Table 50. GPIO_CONFIG Register Field Descriptions
        42. 7.6.1.42 GPIO_IN
          1. Table 51. GPIO_IN Register Field Descriptions
        43. 7.6.1.43 GPIO_OUT
          1. Table 52. GPIO_OUT Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Inductor Selection
        2. 8.2.1.2 Input Capacitor Selection
        3. 8.2.1.3 Output Capacitor Selection
        4. 8.2.1.4 Snubber Components
        5. 8.2.1.5 Supply Filtering Components
      2. 8.2.2 Current Limit vs. Maximum Output Current
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RNF|26
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 I2C Serial Bus Timing Requirements

These specifications are ensured by design. Unless otherwise noted, VIN_Bx = 3.7 V.
MIN MAX UNIT
ƒSCL Serial clock frequency Standard mode 100 kHz
Fast mode 400
Fast mode+ 1 MHz
High-speed mode, Cb = 100 pF 3.4
High-speed mode, Cb = 400 pF 1.7
tLOW SCL low time Standard mode 4.7 µs
Fast mode 1.3
Fast mode+ 0.5
High-speed mode, Cb = 100 pF 160 ns
High-speed mode, Cb = 400 pF 320
tHIGH SCL high time Standard mode 4 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode, Cb = 100 pF 60 ns
High-speed mode, Cb = 400 pF 120
tSU;DAT Data setup time Standard mode 250 ns
Fast mode 100
Fast mode+ 50
High-speed mode 10
tHD;DAT Data hold time Standard mode 10 3450 ns
Fast mode 10 900
Fast mode+ 10
High-speed mode, Cb = 100 pF 10 70 ns
High-speed mode, Cb = 400 pF 10 150
tSU;STA Setup time for a start or a repeated start condition Standard mode 4.7 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode 160 ns
tHD;STA Hold time for a start or a repeated start condition Standard mode 4.0 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode 160 ns
tBUF Bus free time between a stop and start condition Standard mode 4.7 µs
Fast mode 1.3
Fast mode+ 0.5
tSU;STO Setup time for a stop condition Standard mode 4 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode 160 ns
trDA Rise time of SDA signal Standard mode 1000 ns
Fast mode 20 300
Fast mode+ 120
High-speed mode, Cb = 100 pF 10 80
High-speed mode, Cb = 400 pF 20 160
tfDA Fall time of SDA signal Standard mode 300 ns
Fast mode 20 × (VDD / 5.5 V) 300
Fast mode+ 20 × (VDD / 5.5 V) 120
High-speed mode, Cb = 100 pF 10 80
High-speed mode, Cb = 400 pF 30 160
trCL Rise time of SCL signal Standard mode 1000 ns
Fast mode 20 300
Fast mode+ 120
High-speed mode, Cb = 100 pF 10 40
High-speed mode, Cb = 400 pF 20 80
trCL1 Rise time of SCL signal after a repeated start condition and after an acknowledge bit High-speed mode, Cb = 100 pF 10 80 ns
High-speed mode, Cb = 400 pF 20 160
tfCL Fall time of a SCL signal Standard mode 300 ns
Fast mode 20 × (VDD / 5.5 V) 300
Fast mode+ 20 × (VDD / 5.5 V) 120
High-speed mode, Cb = 100 pF 10 40
High-speed mode, Cb = 400 pF 20 80
Cb Capacitive load for each bus line (SCL and SDA) 400 pF
tSP Pulse width of spike suppressed (SCL and SDA spikes that are less than the indicated width are suppressed) Standard mode, fast mode and fast mode+ 50 ns
High-speed mode 10
LP87524B-Q1 LP87524J-Q1 LP87524P-Q1 30190619.gifFigure 1. I2C Timing