SNVS861A February   2014  – August 2014 LP8754

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  General Electrical Characteristics
    6. 6.6  6-Phase Buck Electrical Characteristics
    7. 6.7  6-Phase Buck System Characteristics
    8. 6.8  Protection Features Characteristics
    9. 6.9  I2C Serial Bus Timing Parameters
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Buck Information
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Descriptions
      1. 7.3.1 Multi-Phase DC/DC Converters
        1. 7.3.1.1 Multi-Phase Operation and Phase-Shedding
        2. 7.3.1.2 Transitions Between Low-Power PFM, PFM, and PWM Modes
        3. 7.3.1.3 Buck Converter Load Current
        4. 7.3.1.4 Spread Spectrum Mode
      2. 7.3.2 Power-Up and Output Voltage Sequencing
      3. 7.3.3 Device Reset Scenarios
      4. 7.3.4 Diagnosis and Protection Features
        1. 7.3.4.1 Warnings for Diagnosis (No Power Down)
          1. 7.3.4.1.1 Short-Circuit Protection (SCP)
          2. 7.3.4.1.2 Power Good Monitoring
          3. 7.3.4.1.3 Thermal Warnings
        2. 7.3.4.2 Faults (Fault State and Fast Power Down)
          1. 7.3.4.2.1 Undervoltage Lock-out (UVLO)
          2. 7.3.4.2.2 Overvoltage Protection (OVP)
          3. 7.3.4.2.3 Thermal Shutdown (THSD)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1  Register Descriptions
      2. 7.6.2  VSET_B0
      3. 7.6.3  FPWM
      4. 7.6.4  BUCK0_CTRL
      5. 7.6.5  BUCK1_CTRL
      6. 7.6.6  BUCK2_CTRL
      7. 7.6.7  BUCK3_CTRL
      8. 7.6.8  BUCK4_CTRL
      9. 7.6.9  BUCK5_CTRL
      10. 7.6.10 FLAGS_0
      11. 7.6.11 FLAGS_1
      12. 7.6.12 INT_MASK_0
      13. 7.6.13 GENERAL
      14. 7.6.14 RESET
      15. 7.6.15 DELAY_BUCK0
      16. 7.6.16 CHIP_ID
      17. 7.6.17 PFM_LEV_B0
      18. 7.6.18 PHASE_LEV_B0
      19. 7.6.19 SEL_I_LOAD
      20. 7.6.20 LOAD_CURR
      21. 7.6.21 INT_MASK_2
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 LDO Capacitor Selection
        5. 8.2.2.5 VIOSYS Capacitor Selection
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings (1)(2)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
INPUT VOLTAGE
Voltage on Power Connections (VIOSYS, VDDA5V, VINBXX) −0.3 6 V
Voltage on Logic pins (Input or Output pins) (SCLSYS, SDASYS, NRST, NSLP, ADDR, INT, SCLSR, SDASR) −0.3 6
Buck switch nodes (SWBXX) −0.3 (VVINBXX + 0.2 V) with 6 V max V
VLDO, FBB0+/B0, FBB0−/B1, FBB2, FBB3+/B3, FBB3−/B4, FBB5 −0.3 2 V
All other analog pins −0.3 6
TEMPERATURE
Junction Temperature (TJ-MAX) 150 °C
Maximum Lead Temperature (Soldering, 10 s)(3) 260
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
(3) For detailed soldering specifications and information, please refer to Application Note 1112: DSBGA Wafer-Level Chip-Scale Package (AN-1112).

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range −65 150 °C
V(ESD) (All pins)(1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2) –1000 1000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(3) –250 250
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions (2)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
INPUT VOLTAGE
Voltage on power connections (VDDA5V, VINBXX) 2.5 5 V
Voltage on VIOSYS 1.8 smaller of 3.3 V or VVINBXX V
SCLSYS, SDASYS, ADDR 0 VVIOSYS V
SCLSR, SDASR, NSLP, INT 0 VNRST V
NRST 0 1.8 V
TEMPERATURE
Junction temperature (TJ) −40 125 °C
Ambient temperature (TA) −40 85

6.4 Thermal Information

THERMAL METRIC(1) LP8754 UNIT
YFQ
49 PINS
RθJA Junction-to-ambient thermal resistance 49.2 °C/W
RθJCtop Junction-to-case (top) thermal resistance 0.2
RθJB Junction-to-board thermal resistance 6.6
ψJT Junction-to-top characterization parameter 2.9
ψJB Junction-to-board characterization parameter 6.5
RθJCbot Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 General Electrical Characteristics(1)(2)

Limits apply over the full ambient temperature range -40°C ≤ TA ≤ 85°C, VVDDA5V = VVINBXX = 3.7 V, VVIOSYS = VNRST = 1.8 V, VOUT = 1.1 V, (unless otherwise noted).
SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENTS
ISHDN Shutdown supply current. Total current into power connections VDDA5V and VINBXX VVIOSYS = 0 V, VNRST = 0 V 0.1 2 µA
ISTBY Standby mode supply current. Total current into power connections VDDA5V and VINBXX VVIOSYS = 1.8 V, VNRST = 0 V 50
IActive Active mode current consumption. Total current into power connections VDDA5V and VINBXX Low-power PFM Mode, no load, one core active 130 µA
PFM Mode, no load, one core active 400 µA
Forced PWM Mode, no load, one core active 14.5 mA
LOGIC AND CONTROL INPUTS SCLSYS, SDASYS, ADDR
VIL Input low level VVIOSYS = 1.8 V to 3.3 V 0.3 x VVIOSYS V
VIH Input high level VVIOSYS = 1.8 V to 3.3 V 0.7 x VVIOSYS
Vhys Hysteresis of Schmitt trigger inputs (SCLSYS, SDASYS) 0.1 x VVIOSYS
Ci Capacitance of pins See (3) 4 pF
LOGIC AND CONTROL INPUTS SCLSR, SDASR, NSLP, NRST
VIL Input low level VNRST = 1.8 V 0.3 x VNRST V
VIH Input high level VNRST = 1.8 V 0.7 x VNRST
Vhys Hysteresis of Schmitt trigger inputs (SCLSR, SDASR) 0.1 x VNRST
Ci Capacitance of SCLSR and SDASR pins 4 pF
RIN Input resistance NRST pulldown resistor to GND 1200 kΩ
VIL_NRST Input low level NRST 0.54 V
VIH_NRST Input high level NRST 1.3
LOGIC AND CONTROL OUTPUTS
VOL Output low level Voltage on INT pin, ISINK = 3 mA,
VNRST = VVIOSYS = 1.8 V		 0.4 V
Voltage on SDASYS, SDASR, ISINK = 3 mA,
VNRST = VVIOSYS = 1.8 V		 0.36
RP External pull-up resistor for INT To I/O Supply 10 kΩ
ALL LOGIC AND CONTROL INPUTS
ILEAK Input current All Logic Inputs over pin voltage range. Note that NRST pin does have an 1.2-MΩ internal pulldown resistor and current through this resistor is not included into ILEAK rating. TA = 25°C −1 1 µA
(1) All voltage values are with respect to network ground pin.
(2) Minimum (Min) and Maximum (Max) limits are specified by design, test, or statistical analysis. Typical (Typ.) numbers are not ensured, but do represent the most likely norm.
(3) Maximum capacitance of SCLSYS or SDASYS line is 8 pF, if ADDR pin is connected to line for serial bus address selection.

6.6 6-Phase Buck Electrical Characteristics

Limits apply over the full ambient temperature range -40°C ≤ TA ≤ 85°C, VVDDA5V = VVINBXX = 3.7 V, VVIOSYS = VNRST = 1.8 V, VOUT = 1.1 V, (unless otherwise noted).
SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Differential feedback voltage (1)
VFB0+/B0 - VFB0-/B1		 PWM Mode, VOUTSET = 0.6 V to 1.67 V,
IOUT ≤ 10 A(2)		 min (VOUTSET - 2.5%, VOUTSET - 25 mV) VOUTSET max (VOUTSET + 2.5%, VOUTSET + 25 mV) V
PFM Mode, VOUTSET = 0.6 V to 1.67 V,
IOUT ≤ 375 mA		 min (VOUTSET - 2.5%, VOUTSET - 25 mV) VOUTSET max (VOUTSET + 2.5%, VOUTSET + 25 mV)
Low-Power PFM Mode, VOUTSET = 0.6 V to 1.67 V,
IOUT ≤ 30 mA		 min (VOUTSET - 3%, VOUTSET - 30 mV) VOUTSET max (VOUTSET + 3%, VOUTSET + 30 mV)
ILIMITP High side switch current limit 2.5 A register setting 2050 2600 3300 mA
ILIMITN Low side switch current limit Reverse current 650 900 1050
VOUT Output voltage Range, Programmable by register setting 0.6 1.0 1.67 V
Step 10 mV
fSW Switching frequency 2.5 V ≤ VVINBXX ≤ 5 V 2.7 3.0 3.4 MHz
RDSON_P Pin-pin resistance for PFET Test Current = 200 mA; Split FET 120 mΩ
Test Current = 200 mA; Full FET 60
RDSON_N Pin-pin resistance for NFET IOUT = –200 mA 50
ILK_HS High-side leakage current VSW = 0 V, Per Buck Core 2 µA
ILK_LS Low-side leakage current VSW = 3.7 V = VVINBXX, Per Buck Core 2
RPD Pull-down resistor Enabled via control register, Active only when converter disabled, Per Buck Core 250 Ω
RIN_FB Differential feedback Input resistance  (3) TA = 25°C 200 300 400 kΩ
(1) Due to the nature of the converter operating in PFM mode/Low-Power Mode, the Feedback Voltage accuracy specification is for the lower point of the ripple. Thus the converter will position the average output voltage typically slightly above the nominal PWM-mode output voltage.
(2) The power switches in the LP8754 are designed to operate continuously with currents up to the switch current limit thresholds. However, when continuously operating at high current levels there will be significant heat generated within the IC and thus sustained total DC current which the device can support is typically limited by thermal constraints. Thermal issues will become extremely important when designing PCB and the thermal environment of the LP8754. PCB with high thermal efficiency is required to ensure the junction temperature is kept below 125°C. Completing thermal analyses in early stages of the product design process is highly recommended to predict thermal performance at board level. Under high current load conditions the serial bus master device must monitor the temperature of the converter using the Thermal warning feature, see Protection Features Characteristics. If the 2nd thermal warning is triggered at 120°C, the application must quickly decrease the load current to keep the converter within its recommended operating temperature.
(3) Datasheet min/max specification limits are specified by design.

6.7 6-Phase Buck System Characteristics

Limits apply over the full ambient temperature range -40°C ≤ TA ≤ 85°C, VVDDA5V = VVINBXX = 3.7 V, VVIOSYS = VNRST = 1.8 V, VOUT = 1.1 V, (unless otherwise noted).
SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
KRAMP Ramp timer Programmable via control register (1) mV/µs
RAMP_B0[2:0] = 000 30
RAMP_B0[2:0] = 001 15
RAMP_B0[2:0] = 010 7.5
RAMP_B0[2:0] = 011 3.8
RAMP_B0[2:0] = 100 1.9
RAMP_B0[2:0] = 101 0.94
RAMP_B0[2:0] = 110 0.47
RAMP_B0[2:0] = 111 0.23
TSTART Start-up time Time from NRST-HIGH to start of switching 25 µs
TRAMP VOUT rise time Time to ramp from 5% to 95% of VOUT 20 µs
IPFM–PWM PFM-to-PWM switch–over current threshold Average output current, programmable via control register, VOUT = 1.1 V (2) mA
PFM_EXIT_B0[2:0] = 011 175
PFM_EXIT_B0[2:0] = 100 225
PFM_EXIT_B0[2:0] = 101 275
PFM_EXIT_B0[2:0] = 110 325
PFM_EXIT_B0[2:0] = 111 375
IPWM–PFM PWM-to-PFM switchover current threshold Average output current, Programmable via control register, VOUT = 1.1 V (2) mA
PFM_ENTRY_B0[2:0] = 000 100
PFM_ENTRY_B0[2:0] = 001 125
PFM_ENTRY_B0[2:0] = 010 150
PFM_ENTRY_B0[2:0] = 011 175
PFM_ENTRY_B0[2:0] = 100 225
IADD Phase adding level ADD_PH_B0[2:0] = 010 500 mA
ADD_PH_B0[2:0] = 011 600
ADD_PH_B0[2:0] = 100 700
ADD_PH_B0[2:0] = 101 800
ADD_PH_B0[2:0] = 110 900
ADD_PH_B0[2:0] = 111 1000
ISHED Phase shedding level SHED_PH_B0[2:0] = 000 300 mA
SHED_PH_B0[2:0] = 001 400
SHED_PH_B0[2:0] = 010 500
SHED_PH_B0[2:0] = 011 600
SHED_PH_B0[2:0] = 100 700
SHED_PH_B0[2:0] = 101 800
ΔVOUT Line Regulation 2.5 V ≤ VVINBXX ≤ 5 V
ILOAD = 1 A, forced PWM		 0.05 %/V
Load regulation in PWM mode of operation 100 mA ≤ ILOAD ≤ 10 A, Differential sensing enabled 0.2 %/A
Transient load step response AUTO (no Low-Power PFM) mode, IOUT 0.5 mA → 500 mA → 0.5 mA, 100 ns load step ±30 mV
PWM mode, IOUT 0.6 A → 2 A → 0.6 A, 400-ns load step ±20 mV
PWM mode, IOUT 1 A → 8 A → 1 A, 400-ns load step ±60 mV
Transient line response VVINBXX stepping 3.3 V <—> 3.8 V, tr = tf = 10 µs,
IOUT = 2000 mA DC		 ±15 mV
IOUT Output current DC load each phase 1670 mA
Six phases combined(2) 10000
COUT Output capacitance(4) Effective capacitance during operation, VOUT = 0.6 V to 1.67 V, Min value over TA –40°C to 85°C 30 50 µF
CIN Input capacitance on each input voltage rail (5)(4) Effective capacitance during operation, 2.5 V ≤ VVINBXX ≤ 5 V, Min value over TA –40°C to 85°C 2.5 10 µF
L Output inductance Effective inductance during operation 0.25 0.47 1 µH
IBALANCE Current balancing accuracy IOUT ≥ 1000 mA < 10%
VRIPPLE_PWM Output voltage ripple PWM mode, One phase active(3) COUT ESR = 10 mΩ
PWM mode, IOUT = 200 mA
Switching frequency = 3 MHz 		7 mVPP
VRIPPLE_PFM Output voltage ripple PFM mode(3) COUT ESR = 10 mΩ
PFM mode
IOUT = 100 µA 		8 mVPP
VRIPPLE_LP Output Voltage Ripple Low-Power PFM mode(3) COUT ESR = 10 mΩ
Low-power PFM mode
IOUT = 100 µA 		8 mVPP
(1) In the real application, achievable output voltage ramp profiles are influenced by a number of factors, including the amount of output capacitance, the load current level, the load characteristic (either resistive or constant-current), and the voltage ramp amplitude. Typical values are measured with typical conditions.
(2) The final PFM-to-PWM and PWM-to-PFM switchover current varies slightly and is dependant on the output voltage, input voltage, and the inductor current level. Typical values are measured with typical conditions.
(3) Ripple voltage should be measured at COUT electrode on a well-designed PCB, using suggested inductors and capacitors and with a high-quality scope probe.
(4) Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. The performance of the LP8754 device depends greatly on the care taken in designing the Printed Circuit Board (PCB). The use of low inductance and low serial resistance ceramic capacitors is strongly recommended, while proper grounding is crucial. Attention should be given to decoupling the power supplies. Decoupling capacitors must be connected close to the IC and between the power and ground pins to support high peak currents being drawn from System Power Rail during turn-on of the switching MOSFETs. Keep input and output traces as short as possible, because trace inductance, resistance and capacitance can easily become the performance limiting items.
(5) In addition to these capacitors, at least one higher value capacitor (for example 22 µF) should be placed close to the power pins. Note that cores B0-B1 and B3-B4 do have combined power input pins.

6.8 Protection Features Characteristics

Limits apply over the full ambient temperature range -40°C ≤ TA ≤ 85°C, VVDDA5V = VVINBXX = 3.7 V, VVIOSYS = VNRST = 1.8 V, VOUT = 1.1 V, (unless otherwise noted).
SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOLTAGE MONITORING
VPG Power good threshold voltage Power good threshold for voltage decreasing, % of setting, VOUT = 1.1 V 90%
VOVP Input overvoltage protection trigger point (1)(2) VIN rising. Voltage monitored on VDDA5V pin 5.15 5.30 5.45 V
VUVLO Input undervoltage lockout (UVLO) turn-on threshold (1) VIN falling. Voltage monitored on VDDA5V pin 2.15 2.25 2.35
VSCP Output short-circuit fault threshold Detected by sensing the voltage on converter output with respect to GND. 400 mV
tMASKSCP SCP masking time Triggered by converter start-up, specified by design 400 µs
tMASKPG Power Good masking time Triggered by converter start-up, specified by design 400 µs
Triggered by VSET transition, specified by design
Slew Rate setting mV/µs
30 50 µs
15 100
7.5 200
3.8 400
1.9 800
0.94 1600
0.47 3200
0.23 6400
THERMAL SHUTDOWN AND MONITORING
TSHUT Thermal shutdown (TSD) Threshold, Temperature rising 150 °C
Hysteresis 25
TWARN Thermal warning Temperature rising, 1st warning, Interrupt only 85
Hysteresis 10
Thermal warning prior to TSD Temperature rising, 2nd warning, Interrupt and flag set 120
Hysteresis 10
(1) Undervoltage lock-out (UVLO) and overvoltage protection (OVP) circuits shut down the LP8754 when the system input voltage is outside the desired operating range.
(2) Limits for OVP trigger points apply when VVIOSYS is high. False OVP alarm may occur, if the input voltage rises close to 5 V while VVIOSYS is low.

6.9 I2C Serial Bus Timing Parameters

Serial bus address is selected by the ADDR pin. Connect the pin to GND (addr = 60h), VIOSYS (addr = 61h), SDASYS (addr = 62h), or SCLSYS (addr = 63h). Both of the serial buses share the same address; that is, if addr = 60h is selected for the System bus, the Dynamic Voltage Scaling bus will respond to the same address. Start conditions are used to secure the I2C slave address. During the I2C bus start condition, it is detected whether the ADDR is connected to SDASYS, SCLSYS, GND, or VIOSYS. The I2C host should allow at least 500 µs before sending data to the LP8754 after the rising edge of the VIOSYS line.
These specifications are ensured by design. Limits apply over the full ambient temperature range -40°C ≤ TA ≤ 85°C, VVDDA5V = VVINBXX = 3.7 V, VVIOSYS = VNRST = 1.8 V, VOUT = 1.1 V, (unless otherwise noted).
SYMBOL PARAMETER (See Figure 1) TEST CONDITIONS MIN TYP MAX UNIT
DIGITAL TIMING SPECIFICATIONS (SCL, SDA)(1)(2)(4)
fCLK Serial clock frequency Standard mode 100 kHz
Fast mode 400 kHz
High-speed mode, Cb = 100 pF (max) 3.4 MHz
High-speed mode, Cb = 400 pF (max)(5) 1.7 MHz
tLOW SCL low time Standard mode 4.7 µs
Fast mode 1.3
High-speed mode, Cb = 100 pF (max) 160 ns
High-speed mode, Cb = 400 pF (max)(5) 320
tHIGH SCL high time Standard mode 4.0 µs
Fast mode 0.6
High-speed mode, Cb = 100 pF (max) 60 ns
High-speed mode, Cb = 400 pF (max)(5) 120
tSU;DAT Data setup time Standard mode 250 ns
Fast mode 100
High-speed mode 10
tHD;DAT Data hold time Standard mode 0 3.45 µs
Fast mode 0 0.9
High-speed mode, Cb = 100 pF (max) 0 70 ns
High-speed mode, Cb = 400 pF (max)(5) 0 150
tSU;STA Set-up time for a repeated start condition Standard mode 4.7 µs
Fast mode 0.6
High-speed mode 160 ns
tHD;STA Hold time for a start or a repeated start condition Standard mode 4.0 µs
Fast mode 0.6
High-speed mode 160 ns
tBUF Bus free time between a stop and start condition Standard mode 4.7 µs
Fast mode 1.3
tSU;STO Set-up time for a stop condition Standard mode 4.0 µs
Fast mode 0.6
High-speed mode 160 ns
trDA Rise time of SDA signal Standard mode 1000 ns
Fast mode 20 300 ns
High-speed mode, Cb = 100 pF (max) 10 80 ns
High-speed mode, Cb = 400 pF (max)(5) 20 160 ns
tfDA Fall time of SDA signal Standard mode 300 ns
Fast Mode 6.5 300 ns
High-speed mode, Cb = 100 pF (max) 10 80 ns
High-speed mode, Cb = 400 pF (max)(5) 20 160 ns
trCL Rise time of SCL signal Standard mode 1000 ns
Fast mode 20 300 ns
High-speed mode, Cb = 100 pF (max) 10 40 ns
High-speed mode, Cb = 400 pF (max)(5) 20 80 ns
trCL1 Rise time of SCL signal after a repeated start condition and after anacknowledge bit High-speed mode, Cb = 100 pF (max) 10 80 ns
High-speed mode, Cb = 400 pF (max)(5) 20 160 ns
tfCL Fall time of a SCL signal Standard mode 300 ns
Fast mode 6.5 300 ns
High-speed mode, Cb = 100 pF (max) 10 40 ns
High-speed mode, Cb = 400 pF (max)(5) 20 80 ns
Cb Capacitive load for each bus line (SCL and SDA) 400 pF
tSP Pulse width of spike suppressed(3) Fast mode 50 ns
High-speed mode 10
(1) Unless otherwise stated, 'SDA' in this paragraph refers to both of the SDASR and SDASYS signals, and respectively 'SCL' refers to SCLSR and SCLSYS signals.
(2) Cb refers to the capacitance of one bus line. Cb is expressed in pF units. The specification table provided applies to both of the interfaces; DVS and System interface.
(3) Spike suppression filtering on SCLSYS, SCLSR, SDASYS and SDASR will suppress spikes that are less than the indicated width.
(4) The power-on default setting for the system bus and the DVS bus is High-speed-enabled, there is no handshaking required to initiate High speed.
(5) For bus line loads Cb between 100 pF and 400 pF the timing parameters must be linearly interpolated.
30190619.gifFigure 1. I2C Timing

6.10 Typical Characteristics

Unless otherwise specified: VVDDA5V = VVINBXX = 3.7 V, VOUT = 1.1 V, TA = 25°C
C017_snvs861.png
Figure 2. Phase Adding vs Load Current with Different Level Settings
C010_snvs861.png
VVIOSYS = 1.8 V VNRST = 0 V
Figure 4. Standby Mode Current Consumption vs VIN
C002_snvs861.png
PFM Mode No load One core active
Figure 6. PFM Mode Current Consumption vs VIN
C018_snvs861.png
Figure 3. Phase Shedding vs Load Current with Different Level Settings
C001_snvs861.png
Low-Power Mode No load One core active
Figure 5. Low-Power PFM Mode Current Consumption vs VIN
C003_snvs861.png
PWM Mode No load One core active
Figure 7. PWM Mode Current Consumption vs VIN