SNVSA06C March   2015  – August 2018 LP8758-B0

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
    1.     Efficiency vs Output Current (VIN = 3.7 V)
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Serial Bus Timing Parameter
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Buck Information
        1. 8.1.1.1 Operating Modes
        2. 8.1.1.2 Features
        3. 8.1.1.3 Programmability
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Multi-Phase DC-DC Converters
        1. 8.3.1.1 Overview
        2. 8.3.1.2 Multi-Phase Operation and Phase Adding/Shedding
        3. 8.3.1.3 Transition Between PWM and PFM Modes
        4. 8.3.1.4 Multi-Phase Switcher Configurations
        5. 8.3.1.5 Buck Converter Load Current Measurement
        6. 8.3.1.6 Spread-Spectrum Mode
      2. 8.3.2 Power-Up
      3. 8.3.3 Regulator Control
        1. 8.3.3.1 Enabling and Disabling Regulator
        2. 8.3.3.2 Changing Output Voltage
      4. 8.3.4 Device Reset Scenarios
      5. 8.3.5 Diagnosis and Protection Features
        1. 8.3.5.1 Warnings for Diagnosis (Interrupt)
          1. 8.3.5.1.1 Output Current Limit
          2. 8.3.5.1.2 Thermal Warning
        2. 8.3.5.2 Protection (Regulator Disable)
          1. 8.3.5.2.1 Short-Circuit and Overload Protection
          2. 8.3.5.2.2 Thermal Shutdown
        3. 8.3.5.3 Fault (Power Down)
          1. 8.3.5.3.1 Undervoltage Lockout
      6. 8.3.6 Digital Signal Filtering
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 Start and Stop Conditions
        3. 8.5.1.3 Transferring Data
        4. 8.5.1.4 I2C-Compatible Chip Address
        5. 8.5.1.5 Auto Increment Feature
    6. 8.6 Register Maps
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1  DEV_REV
        2. 8.6.1.2  OTP_REV
        3. 8.6.1.3  BUCK0_CTRL1
        4. 8.6.1.4  BUCK0_CTRL2
        5. 8.6.1.5  BUCK1_CTRL2
        6. 8.6.1.6  BUCK2_CTRL2
        7. 8.6.1.7  BUCK3_CTRL2
        8. 8.6.1.8  BUCK0_VOUT
        9. 8.6.1.9  BUCK0_FLOOR_VOUT
        10. 8.6.1.10 BUCK0_DELAY
        11. 8.6.1.11 RESET
        12. 8.6.1.12 CONFIG
        13. 8.6.1.13 INT_TOP
        14. 8.6.1.14 INT_BUCK_0_1
        15. 8.6.1.15 INT_BUCK_2_3
        16. 8.6.1.16 TOP_STAT
        17. 8.6.1.17 BUCK_0_1_STAT
        18. 8.6.1.18 BUCK_2_3_STAT
        19. 8.6.1.19 TOP_MASK
        20. 8.6.1.20 BUCK_0_1_MASK
        21. 8.6.1.21 BUCK_2_3_MASK
        22. 8.6.1.22 SEL_I_LOAD
        23. 8.6.1.23 I_LOAD_2
        24. 8.6.1.24 I_LOAD_1
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application Components
          1. 9.2.2.1.1 Inductor Selection
          2. 9.2.2.1.2 Input Capacitor Selection
          3. 9.2.2.1.3 Output Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1.1 Overview

A multi-phase synchronous buck converter offers several advantages over a single power stage converter. For application processor power delivery, lower ripple on the input and output currents and faster transient response to load steps are the most significant advantages. Also, since the load current is evenly shared among multiple channels, the heat generated is greatly reduced for each channel due to the fact that power loss is proportional to square of current. Physical size of the output inductor shrinks significantly due to this heat reduction. A block diagram of a single core is shown in Figure 7.

Interleaving switching action of the converters and channels in a four-phase configuration is illustrated in Figure 8.

LP8758-B0 30190604.gifFigure 7. Detailed Block Diagram Showing One Core
LP8758-B0 ai_phases360_SNVSA05.gifFigure 8. PWM Timings and Inductor Current Waveforms in 4-phase Configuration (1)
1. Graph is not in scale and is for illustrative purposes only.