SNVSC07A June   2021  – September 2022 LP876242-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Digital Signal Descriptions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Internal Low Drop-Out Regulators (LDOVINT)
    6. 6.6  BUCK1, BUCK2, BUCK3, and BUCK4 Regulators
    7. 6.7  Reference Generator (REFOUT)
    8. 6.8  Monitoring Functions
    9. 6.9  Clocks, Oscillators, and DPLL
    10. 6.10 Thermal Monitoring and Shutdown
    11. 6.11 System Control Thresholds
    12. 6.12 Current Consumption
    13. 6.13 Digital Input Signal Parameters
    14. 6.14 Digital Output Signal Parameters
    15. 6.15 I/O Pullup and Pulldown Resistance
    16. 6.16 I2C Interface
    17. 6.17 Serial Peripheral Interface (SPI)
    18.     25
    19. 6.18 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage Monitor
      2. 7.3.2 Power Resources
        1. 7.3.2.1 Buck Regulators
          1. 7.3.2.1.1 BUCK Regulator Overview
          2. 7.3.2.1.2 Spread-Spectrum Mode
          3. 7.3.2.1.3 Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
          4. 7.3.2.1.4 BUCK Output Voltage Setting
          5. 7.3.2.1.5 Sync Clock Functionality
        2. 7.3.2.2 Internal Low Dropout Regulator (LDOVINT)
      3. 7.3.3 Residual Voltage Checking
      4. 7.3.4 Output Voltage Monitor and PGOOD Generation
      5. 7.3.5 General-Purpose I/Os (GPIO Pins)
      6. 7.3.6 Thermal Monitoring
        1. 7.3.6.1 Thermal Warning Function
        2. 7.3.6.2 Thermal Shutdown
      7. 7.3.7 Interrupts
      8. 7.3.8 Watchdog (WD)
        1. 7.3.8.1 Watchdog Fail Counter and Status
        2. 7.3.8.2 Watchdog Start-Up and Configuration
        3. 7.3.8.3 MCU to Watchdog Synchronization
        4. 7.3.8.4 Watchdog Disable Function
        5. 7.3.8.5 Watchdog Sequence
        6. 7.3.8.6 Watchdog Trigger Mode
        7. 7.3.8.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
        8.       55
        9. 7.3.8.8 Watchdog Question-Answer Mode
          1. 7.3.8.8.1 Watchdog Q&A Related Definitions
          2. 7.3.8.8.2 Question Generation
          3. 7.3.8.8.3 Answer Comparison
            1. 7.3.8.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
            2. 7.3.8.8.3.2 Watchdog Sequence Events and Status Updates
            3. 7.3.8.8.3.3 Watchdog Q&A Sequence Scenarios
      9. 7.3.9 Error Signal Monitor (ESM)
        1. 7.3.9.1 ESM Error-Handling Procedure
        2. 7.3.9.2 Level Mode
        3.       66
        4. 7.3.9.3 PWM Mode
          1. 7.3.9.3.1 Good-Events and Bad-Events
          2. 7.3.9.3.2 ESM Error-Counter
            1. 7.3.9.3.2.1 ESM Start-Up in PWM Mode
          3. 7.3.9.3.3 ESM Flow Chart and Timing Diagrams in PWM Mode
          4.        72
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device State Machine
        1. 7.4.1.1 Fixed Device Power FSM
          1. 7.4.1.1.1 Register Resets and EEPROM read at INIT state
        2. 7.4.1.2 Pre-Configurable Mission States
          1. 7.4.1.2.1 PFSM Commands
            1. 7.4.1.2.1.1  REG_WRITE_IMM Command
            2. 7.4.1.2.1.2  REG_WRITE_MASK_IMM Command
            3. 7.4.1.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
            4. 7.4.1.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
            5. 7.4.1.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
            6. 7.4.1.2.1.6  REG_WRITE_VOUT_IMM Command
            7. 7.4.1.2.1.7  REG_WRITE_VCTRL_IMM Command
            8. 7.4.1.2.1.8  REG_WRITE_MASK_SREG Command
            9. 7.4.1.2.1.9  SREG_READ_REG Command
            10. 7.4.1.2.1.10 SREG_WRITE_IMM Command
            11. 7.4.1.2.1.11 WAIT Command
            12. 7.4.1.2.1.12 DELAY_IMM Command
            13. 7.4.1.2.1.13 DELAY_SREG Command
            14. 7.4.1.2.1.14 TRIG_SET Command
            15. 7.4.1.2.1.15 TRIG_MASK Command
            16. 7.4.1.2.1.16 END Command
          2. 7.4.1.2.2 Configuration Memory Organization and Sequence Execution
          3. 7.4.1.2.3 Mission State Configuration
          4. 7.4.1.2.4 Pre-Configured Hardware Transitions
            1. 7.4.1.2.4.1 ON Requests
            2. 7.4.1.2.4.2 OFF Requests
            3. 7.4.1.2.4.3 NSLEEP1 and NSLEEP2 Functions
            4. 7.4.1.2.4.4 WKUP1 and WKUP2 Functions
        3. 7.4.1.3 Error Handling Operations
          1. 7.4.1.3.1 Power Rail Output Error
          2. 7.4.1.3.2 Boot BIST Error
          3. 7.4.1.3.3 Runtime BIST Error
          4. 7.4.1.3.4 Catastrophic Error
          5. 7.4.1.3.5 Watchdog (WDOG) Error
          6. 7.4.1.3.6 Error Signal Monitor (ESM) Error
          7. 7.4.1.3.7 Warnings
        4. 7.4.1.4 Device Start-up Timing
        5. 7.4.1.5 Power Sequences
        6. 7.4.1.6 First Supply Detection
      2. 7.4.2 Multi-PMIC Synchronization
        1. 7.4.2.1 SPMI Interface System Setup
        2. 7.4.2.2 Transmission Protocol and CRC
          1. 7.4.2.2.1 Operation with Transmission Errors
          2. 7.4.2.2.2 Transmitted Information
        3. 7.4.2.3 SPMI Target Device Communication to SPMI Controller Device
          1. 7.4.2.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
        4. 7.4.2.4 SPMI-BIST Overview
          1. 7.4.2.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
          2. 7.4.2.4.2 Periodic Checking of the SPMI
          3. 7.4.2.4.3 SPMI Message Priorities
    5. 7.5 Control Interfaces
      1. 7.5.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 7.5.2 I2C-Compatible Interface
        1. 7.5.2.1 Data Validity
        2. 7.5.2.2 Start and Stop Conditions
        3. 7.5.2.3 Transferring Data
        4. 7.5.2.4 Auto-Increment Feature
      3. 7.5.3 Serial Peripheral Interface (SPI)
    6. 7.6 NVM Configurable Registers
      1. 7.6.1 Register Page Partitioning
      2. 7.6.2 CRC Protection for Configuration, Control, and Test Registers
      3. 7.6.3 CRC Protection for User Registers
      4. 7.6.4 Register Write Protection
        1. 7.6.4.1 ESM and Watchdog Configuration Registers
        2. 7.6.4.2 User Registers
    7. 7.7 Register Map
      1. 7.7.1 LP876242_map Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Buck Inductor Selection
        2. 8.2.1.2 Buck Input Capacitor Selection
        3. 8.2.1.3 Buck Output Capacitor Selection
        4. 8.2.1.4 LDO Output Capacitor Selection
        5. 8.2.1.5 VCCA Supply Filtering Components
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Voltage Scaling Precautions
      4. 8.2.4 Application Curves
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
    4. 8.4 Power Supply Recommendations
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.6 Thermal Monitoring

The LP876242-Q1 device includes several thermal monitoring functions for internal thermal protection of the PMIC.

The LP876242-Q1 device integrates thermal detection modules to monitor the temperature of the die. These modules are placed on opposite sides of the device and close to the BUCK modules. An over-temperature condition at either module first generates a warning to the system, and if the temperature continues to rise, then a switch-off of the PMIC device can occur before damage to the die.

Three thermal protection levels are available. One of these protections is a thermal warning function described in Section 7.3.6.1, that sends an interrupt to software. Software is expected to close any noncritical running tasks to reduce power. The second and third protections are the thermal shutdown (TS) function described in Section 7.3.6.2, that begins device shutdown orderly or immediately.

Thermal monitoring is automatically enabled when one of the BUCK outputs is enabled within the mission states. The thermal monitoring is disabled in the LP_STANDBY state, when only the internal regulator is enabled, to minimize the device power consumption. Indication of a thermal warning event is written to the TWARN_INT register.

The current consumption of the thermal monitoring can be decreased in the mission states when the low power dissipation is important. If LPM_EN bit is set and the temperature is below thermal warning level in all thermal detection modules, only one thermal detection module is monitored. If the temperature rises in this module, monitoring in all thermal detection modules is started.

If the die temperature of the LP876242-Q1 device continues to rise while the device is in mission state, an TSD_ORD_INT or TSD_IMM_INT interrupt is generated, causing a SEVERE or MODERATE error trigger (respectively) in the state machine. While the sequencing and error handling is NVM memory dependent, TI recommends a sequenced shutdown for MODERATE errors, and an immediate shutdown, using resistive discharging, for SEVERE errors to prevent damage to the device. The system cannot restart until the temperature falls below the thermal warning threshold.