SNVSC07A June   2021  – September 2022 LP876242-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1. 5.1 Digital Signal Descriptions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Internal Low Drop-Out Regulators (LDOVINT)
    6. 6.6  BUCK1, BUCK2, BUCK3, and BUCK4 Regulators
    7. 6.7  Reference Generator (REFOUT)
    8. 6.8  Monitoring Functions
    9. 6.9  Clocks, Oscillators, and DPLL
    10. 6.10 Thermal Monitoring and Shutdown
    11. 6.11 System Control Thresholds
    12. 6.12 Current Consumption
    13. 6.13 Digital Input Signal Parameters
    14. 6.14 Digital Output Signal Parameters
    15. 6.15 I/O Pullup and Pulldown Resistance
    16. 6.16 I2C Interface
    17. 6.17 Serial Peripheral Interface (SPI)
    18.     25
    19. 6.18 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage Monitor
      2. 7.3.2 Power Resources
        1. 7.3.2.1 Buck Regulators
          1. 7.3.2.1.1 BUCK Regulator Overview
          2. 7.3.2.1.2 Spread-Spectrum Mode
          3. 7.3.2.1.3 Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
          4. 7.3.2.1.4 BUCK Output Voltage Setting
          5. 7.3.2.1.5 Sync Clock Functionality
        2. 7.3.2.2 Internal Low Dropout Regulator (LDOVINT)
      3. 7.3.3 Residual Voltage Checking
      4. 7.3.4 Output Voltage Monitor and PGOOD Generation
      5. 7.3.5 General-Purpose I/Os (GPIO Pins)
      6. 7.3.6 Thermal Monitoring
        1. 7.3.6.1 Thermal Warning Function
        2. 7.3.6.2 Thermal Shutdown
      7. 7.3.7 Interrupts
      8. 7.3.8 Watchdog (WD)
        1. 7.3.8.1 Watchdog Fail Counter and Status
        2. 7.3.8.2 Watchdog Start-Up and Configuration
        3. 7.3.8.3 MCU to Watchdog Synchronization
        4. 7.3.8.4 Watchdog Disable Function
        5. 7.3.8.5 Watchdog Sequence
        6. 7.3.8.6 Watchdog Trigger Mode
        7. 7.3.8.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
        8.       55
        9. 7.3.8.8 Watchdog Question-Answer Mode
          1. 7.3.8.8.1 Watchdog Q&A Related Definitions
          2. 7.3.8.8.2 Question Generation
          3. 7.3.8.8.3 Answer Comparison
            1. 7.3.8.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
            2. 7.3.8.8.3.2 Watchdog Sequence Events and Status Updates
            3. 7.3.8.8.3.3 Watchdog Q&A Sequence Scenarios
      9. 7.3.9 Error Signal Monitor (ESM)
        1. 7.3.9.1 ESM Error-Handling Procedure
        2. 7.3.9.2 Level Mode
        3.       66
        4. 7.3.9.3 PWM Mode
          1. 7.3.9.3.1 Good-Events and Bad-Events
          2. 7.3.9.3.2 ESM Error-Counter
            1. 7.3.9.3.2.1 ESM Start-Up in PWM Mode
          3. 7.3.9.3.3 ESM Flow Chart and Timing Diagrams in PWM Mode
          4.        72
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device State Machine
        1. 7.4.1.1 Fixed Device Power FSM
          1. 7.4.1.1.1 Register Resets and EEPROM read at INIT state
        2. 7.4.1.2 Pre-Configurable Mission States
          1. 7.4.1.2.1 PFSM Commands
            1. 7.4.1.2.1.1  REG_WRITE_IMM Command
            2. 7.4.1.2.1.2  REG_WRITE_MASK_IMM Command
            3. 7.4.1.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
            4. 7.4.1.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
            5. 7.4.1.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
            6. 7.4.1.2.1.6  REG_WRITE_VOUT_IMM Command
            7. 7.4.1.2.1.7  REG_WRITE_VCTRL_IMM Command
            8. 7.4.1.2.1.8  REG_WRITE_MASK_SREG Command
            9. 7.4.1.2.1.9  SREG_READ_REG Command
            10. 7.4.1.2.1.10 SREG_WRITE_IMM Command
            11. 7.4.1.2.1.11 WAIT Command
            12. 7.4.1.2.1.12 DELAY_IMM Command
            13. 7.4.1.2.1.13 DELAY_SREG Command
            14. 7.4.1.2.1.14 TRIG_SET Command
            15. 7.4.1.2.1.15 TRIG_MASK Command
            16. 7.4.1.2.1.16 END Command
          2. 7.4.1.2.2 Configuration Memory Organization and Sequence Execution
          3. 7.4.1.2.3 Mission State Configuration
          4. 7.4.1.2.4 Pre-Configured Hardware Transitions
            1. 7.4.1.2.4.1 ON Requests
            2. 7.4.1.2.4.2 OFF Requests
            3. 7.4.1.2.4.3 NSLEEP1 and NSLEEP2 Functions
            4. 7.4.1.2.4.4 WKUP1 and WKUP2 Functions
        3. 7.4.1.3 Error Handling Operations
          1. 7.4.1.3.1 Power Rail Output Error
          2. 7.4.1.3.2 Boot BIST Error
          3. 7.4.1.3.3 Runtime BIST Error
          4. 7.4.1.3.4 Catastrophic Error
          5. 7.4.1.3.5 Watchdog (WDOG) Error
          6. 7.4.1.3.6 Error Signal Monitor (ESM) Error
          7. 7.4.1.3.7 Warnings
        4. 7.4.1.4 Device Start-up Timing
        5. 7.4.1.5 Power Sequences
        6. 7.4.1.6 First Supply Detection
      2. 7.4.2 Multi-PMIC Synchronization
        1. 7.4.2.1 SPMI Interface System Setup
        2. 7.4.2.2 Transmission Protocol and CRC
          1. 7.4.2.2.1 Operation with Transmission Errors
          2. 7.4.2.2.2 Transmitted Information
        3. 7.4.2.3 SPMI Target Device Communication to SPMI Controller Device
          1. 7.4.2.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
        4. 7.4.2.4 SPMI-BIST Overview
          1. 7.4.2.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
          2. 7.4.2.4.2 Periodic Checking of the SPMI
          3. 7.4.2.4.3 SPMI Message Priorities
    5. 7.5 Control Interfaces
      1. 7.5.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 7.5.2 I2C-Compatible Interface
        1. 7.5.2.1 Data Validity
        2. 7.5.2.2 Start and Stop Conditions
        3. 7.5.2.3 Transferring Data
        4. 7.5.2.4 Auto-Increment Feature
      3. 7.5.3 Serial Peripheral Interface (SPI)
    6. 7.6 NVM Configurable Registers
      1. 7.6.1 Register Page Partitioning
      2. 7.6.2 CRC Protection for Configuration, Control, and Test Registers
      3. 7.6.3 CRC Protection for User Registers
      4. 7.6.4 Register Write Protection
        1. 7.6.4.1 ESM and Watchdog Configuration Registers
        2. 7.6.4.2 User Registers
    7. 7.7 Register Map
      1. 7.7.1 LP876242_map Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Buck Inductor Selection
        2. 8.2.1.2 Buck Input Capacitor Selection
        3. 8.2.1.3 Buck Output Capacitor Selection
        4. 8.2.1.4 LDO Output Capacitor Selection
        5. 8.2.1.5 VCCA Supply Filtering Components
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Voltage Scaling Precautions
      4. 8.2.4 Application Curves
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
    4. 8.4 Power Supply Recommendations
  9. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

The high frequency and large switching currents of the device make the choice of layout important. Good power supply results only occur when care is given to correct design and layout. Layout affects noise pickup and generation and can cause a good design to perform with less-than-expected results. With a range of output currents from milliamps to 10 A and over, good power supply layout is much more difficult than most general PCB design. Use the following steps as a reference to ensure the device is stable and maintains correct voltage and current regulation across its intended operating voltage and current range.

  1. Place CIN as close as possible to the PVIN_Bx pin and the PGND pin. Route the VIN trace wide and thick to avoid IR drops. The trace between the positive node of the input capacitor and the PVIN_Bx pins of the device, as well as the trace between the negative node of the input capacitor and power PGND pin, must be kept as short as possible. The input capacitance provides a low-impedance voltage source for the switching converter. The inductance of the connection is the most important parameter of a local decoupling capacitor — parasitic inductance on these traces must be kept as small as possible for correct device operation. The parasitic inductance can be reduced by using a ground plane as close as possible to top layer by using thin dielectric layer between top layer and ground plane.
  2. The output filter, consisting of COUT and L, converts the switching signal at SW_Bx to the noiseless output voltage. The output filter must be placed as close as possible to the device keeping the switch node small, for best EMI behavior. Route the traces between the output capacitors of the device and the load direct and wide to avoid losses due to the IR drop.
  3. Input for analog blocks (VCCA and AGND) must be isolated from noisy signals. Connect VCCA directly to a quiet system voltage node and AGND to a quiet ground point where no IR drop occurs. Place the decoupling capacitor as close as possible to the VCCA pin.
  4. If the processor load supports remote voltage sensing, connect the feedback pins FB_Bx of the device to the respective sense pins on the processor. The sense lines are susceptible to noise. They must be kept away from noisy signals such as PGND, PVIN_Bx, and SW_Bx, as well as high bandwidth signals such as the I2C. Avoid both capacitive and inductive coupling by keeping the sense lines short, direct, and close to each other. Run the lines in a quiet layer. Isolate them from noisy signals by a voltage or ground plane if possible. Running the signal as a differential pair is recommended. If series resistors are used for load current measurement, place them after connection of the voltage feedback.
  5. PGND, PVIN_Bx, and SW_Bx must be routed on thick layers. They must not surround inner signal layers, that are not able to withstand interference from noisy PGND, PVIN_Bx and SW_Bx.

Due to the small package of this converter and the overall small solution size, the thermal performance of the PCB layout is important. Many system-dependent parameters such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component. Proper PCB layout, focusing on thermal performance, results in lower die temperatures. Wide and thick power traces come with the ability to sink dissipated heat. The heat dissipation can be improved further on multi-layer PCB designs with vias to different planes, that results in reduced junction-to-ambient (RθJA) and junction-to-board (RθJB) thermal resistances and thereby reduces the device junction temperature, TJ. TI strongly recommends to perform of a careful system-level 2D or full 3D dynamic thermal analysis at the beginning product design process, by using a thermal modeling analysis software.