SDLS975 April   2024 LSF0002

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics (Translating Down): BN = 3.3V
    7. 5.7 Switching Characteristics (Translating Down): BN = 2.5V
    8. 5.8 Switching Characteristics (Translating Up): BN = 3.3V
    9. 5.9 Switching Characteristics (Translating Up):BN = 2.5V
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Auto Bidirectional Voltage Translation
      2. 7.3.2 VBIAS/ Enable
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Open-Drain Interface (I2C, PMBus, SMBus, and GPIO)
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Enable and Disable Guidelines
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Bidirectional Translation
          2. 8.2.1.2.2 Pull-Up Resistor Sizing
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Mixed-Mode Voltage Translation
      3. 8.2.3 Voltage Translation for Vref_B < Vref_A + 0.8V
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DTQ|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Application Information

The LSF devices can perform voltage translation for open-drain or push-pull interfaces. Table 8-1 provides common interfaces and the corresponding device recommendation from the LSF family, which supports the corresponding bit count.

Table 8-1 Voltage Translator for Common Interfaces
Part NameChannel NumberInterface
LSF00022GPIO, MDIO, SMBus, PMBus, and I2C

Some important reminders regarding the LSF0002 are as follows:

  • LSF devices are switch-based, not buffer-based (for more information, see the TXB family for buffer-based devices).
  • Specific data rates cannot be calculated by using 1/Tpd.
  • VEXT,A/VEXT,B are referenced to the external power supplies at the I/Os.
  • VBIAS should be tied towards the lowest voltage being translated to at the I/Os.