SLAS703C April   2010  – September 2020 MSP430BT5190

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Functional Block Diagram
  5. 5Revision History
  6. 6Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1. 6.2.1 Terminal Functions
  7. 7Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 7.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 7.6  Thermal Characteristics
    7. 7.7  Schmitt-Trigger Inputs – General-Purpose I/O
    8. 7.8  Inputs – Ports P1 and P2
    9. 7.9  Leakage Current – General-Purpose I/O
    10. 7.10 Outputs – General-Purpose I/O (Full Drive Strength)
    11. 7.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
    12. 7.12 Output Frequency – General-Purpose I/O
    13. 7.13 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    14. 7.14 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    15. 7.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 7.16 Crystal Oscillator, XT1, High-Frequency Mode
    17. 7.17 Crystal Oscillator, XT2
    18. 7.18 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    19. 7.19 Internal Reference, Low-Frequency Oscillator (REFO)
    20. 7.20 DCO Frequency
    21. 7.21 PMM, Brown-Out Reset (BOR)
    22. 7.22 PMM, Core Voltage
    23. 7.23 PMM, SVS High Side
    24. 7.24 PMM, SVM High Side
    25. 7.25 PMM, SVS Low Side
    26. 7.26 PMM, SVM Low Side
    27. 7.27 Wake-up Times From Low-Power Modes and Reset
    28. 7.28 Timer_A
    29. 7.29 Timer_B
    30. 7.30 USCI (UART Mode), Recommended Operating Conditions
    31. 7.31 USCI (UART Mode)
    32. 7.32 USCI (SPI Master Mode), Recommended Operating Conditions
    33. 7.33 USCI (SPI Master Mode)
    34. 7.34 USCI (SPI Slave Mode)
    35. 7.35 USCI (I2C Mode)
    36. 7.36 12-Bit ADC, Power Supply and Input Range Conditions
    37. 7.37 12-Bit ADC, Timing Parameters
    38. 7.38 12-Bit ADC, Linearity Parameters
    39. 7.39 12-Bit ADC, Temperature Sensor and Built-In VMID
    40. 7.40 REF, External Reference
    41. 7.41 REF, Built-In Reference
    42. 7.42 Flash Memory
    43. 7.43 JTAG and Spy-Bi-Wire Interface
  8. 8Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
    3. 8.3  Interrupt Vector Addresses
    4. 8.4  Memory Organization
    5. 8.5  Bootstrap Loader (BSL)
    6. 8.6  JTAG Operation
      1. 8.6.1 JTAG Standard Interface
      2. 8.6.2 Spy-Bi-Wire Interface
    7. 8.7  Flash Memory
    8. 8.8  RAM
    9. 8.9  Peripherals
      1. 8.9.1  Digital I/O
      2. 8.9.2  Oscillator and System Clock
      3. 8.9.3  Power-Management Module (PMM)
      4. 8.9.4  Hardware Multiplier (MPY)
      5. 8.9.5  Real-Time Clock (RTC_A)
      6. 8.9.6  Watchdog Timer (WDT_A)
      7. 8.9.7  System Module (SYS)
      8. 8.9.8  DMA Controller
      9. 8.9.9  Universal Serial Communication Interface (USCI)
      10. 8.9.10 TA0
      11. 8.9.11 TA1
      12. 8.9.12 TB0
      13. 8.9.13 ADC12_A
      14. 8.9.14 CRC16
      15. 8.9.15 REF Voltage Reference
      16. 8.9.16 Embedded Emulation Module (EEM) (L Version)
      17. 8.9.17 Peripheral File Map
    10. 8.10 Input/Output Schematics
      1. 8.10.1  Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
      2. 8.10.2  Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
      3. 8.10.3  Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
      4. 8.10.4  Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
      5. 8.10.5  Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
      6. 8.10.6  Port P5, P5.2, Input/Output With Schmitt Trigger
      7. 8.10.7  Port P5, P5.3, Input/Output With Schmitt Trigger
      8. 8.10.8  Port P5, P5.4 to P5.7, Input/Output With Schmitt Trigger
      9. 8.10.9  Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
      10. 8.10.10 Port P7, P7.0, Input/Output With Schmitt Trigger
      11. 8.10.11 Port P7, P7.1, Input/Output With Schmitt Trigger
      12. 8.10.12 Port P7, P7.2 and P7.3, Input/Output With Schmitt Trigger
      13. 8.10.13 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
      14. 8.10.14 Port P8, P8.0 to P8.7, Input/Output With Schmitt Trigger
      15. 8.10.15 Port P9, P9.0 to P9.7, Input/Output With Schmitt Trigger
      16. 8.10.16 Port P10, P10.0 to P10.7, Input/Output With Schmitt Trigger
      17. 8.10.17 Port P11, P11.0 to P11.2, Input/Output With Schmitt Trigger
      18. 8.10.18 Port J, J.0 JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      19. 8.10.19 Port J, J.1 to J.3 JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 8.11 Device Descriptors (TLV)
  9. 9Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Getting Started and Next Steps
      2. 9.1.2 Development Tools Support
        1. 9.1.2.1 Hardware Features
        2. 9.1.2.2 Recommended Hardware Options
          1. 9.1.2.2.1 Experimenter Boards
          2. 9.1.2.2.2 Debugging and Programming Tools
          3. 9.1.2.2.3 Production Programmers
        3. 9.1.2.3 Recommended Software Options
          1. 9.1.2.3.1 Integrated Development Environments
          2. 9.1.2.3.2 MSP430Ware
          3. 9.1.2.3.3 TI-RTOS
          4. 9.1.2.3.4 Command-Line Programmer
      3. 9.1.3 Device Nomenclature
    2. 9.2 Documentation Support
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Export Control Notice
    7. 9.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.39 12-Bit ADC, Temperature Sensor and Built-In VMID

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER(1)TEST CONDITIONSVCCMINTYPMAXUNIT
VSENSORSee (2)ADC12ON = 1, INCH = 0Ah,
TA = 0°C		2.2 V680mV
3 V680
TCSENSORADC12ON = 1, INCH = 0Ah2.2 V2.25mV/°C
3 V2.25
tSENSOR(sample)Sample time required if channel 10 is selected(3)ADC12ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB		2.2 V100µs
3 V100
VMIDAVCC divider at channel 11,
VAVCC factor		ADC12ON = 1, INCH = 0Bh0.480.50.52VAVCC
AVCC divider at channel 11ADC12ON = 1, INCH = 0Bh2.2 V1.061.11.14V
3 V1.441.51.56
tVMID(sample)Sample time required if channel 11 is selected(4)ADC12ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB		2.2 V, 3 V1000ns
(1) The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of the temperature sensor.
(2) The temperature sensor offset can be significant. TI recommends a single-point calibration to minimize the offset error of the built-in temperature sensor. The TLV structure contains calibration values for 30°C ±3°C and 85°C ±3°C for each of the available reference voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR × (Temperature,°C) + VSENSOR, where TCSENSOR and VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208).
(3) The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
(4) The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
GUID-DF2F9C2B-C804-441D-8E19-E2CE9959FABC-low.gifFigure 7-16 Typical Temperature Sensor Voltage