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MSPM0G110x Mixed-Signal Microcontrollers
SLASF11C
February 2023 – October 2023
MSPM0G1106
,
MSPM0G1107
PRODUCTION DATA
CONTENTS
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MSPM0G110x Mixed-Signal Microcontrollers
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagrams
6.2
Pin Attributes
6.3
Signal Descriptions
6.4
Connections for Unused Pins
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Supply Current Characteristics
7.5.1
RUN/SLEEP Modes
7.5.2
STOP/STANDBY Modes
7.5.3
SHUTDOWN Mode
7.6
Power Supply Sequencing
7.6.1
POR and BOR
7.6.2
Power Supply Ramp
7.7
Flash Memory Characteristics
7.8
Timing Characteristics
7.9
Clock Specifications
7.9.1
System Oscillator (SYSOSC)
7.9.1.1
SYSOSC Typical Frequency Accuracy
7.9.2
Low Frequency Oscillator (LFOSC)
7.9.3
System Phase Lock Loop (SYSPLL)
7.9.4
Low Frequency Crystal/Clock
7.9.5
High Frequency Crystal/Clock
7.10
Digital IO
7.10.1
Electrical Characteristics
7.10.2
Switching Characteristics
7.11
Analog Mux VBOOST
7.12
ADC
7.12.1
Electrical Characteristics
7.12.2
Switching Characteristics
7.12.3
Linearity Parameters
7.12.4
Typical Connection Diagram
7.13
Temperature Sensor
7.14
VREF
7.14.1
Voltage Characteristics
7.14.2
Electrical Characteristics
7.15
GPAMP
7.15.1
Electrical Characteristics
7.15.2
Switching Characteristics
7.16
I2C
7.16.1
I2C Timing Diagram
7.16.2
I2C Characteristics
7.16.3
I2C Filter
7.17
SPI
7.17.1
SPI
7.17.2
SPI Timing Diagram
7.18
UART
7.19
TIMx
7.20
Emulation and Debug
7.20.1
SWD Timing
8
Detailed Description
8.1
CPU
8.2
Operating Modes
8.2.1
Functionality by Operating Mode (MSPM0G110x)
8.3
Power Management Unit (PMU)
8.4
Clock Module (CKM)
8.5
DMA
8.6
Events
8.7
Memory
8.7.1
Memory Organization
8.7.2
Peripheral File Map
8.7.3
Peripheral Interrupt Vector
8.8
Flash Memory
8.9
SRAM
8.10
GPIO
8.11
IOMUX
8.12
ADC
8.13
Temperature Sensor
8.14
VREF
8.15
GPAMP
8.16
CRC
8.17
UART
8.18
I2C
8.19
SPI
8.20
WWDT
8.21
RTC
8.22
Timers (TIMx)
8.23
Device Analog Connections
8.24
Input/Output Diagrams
8.25
Serial Wire Debug Interface
8.26
Bootstrap Loader (BSL)
8.27
Device Factory Constants
8.28
Identification
9
Applications, Implementation, and Layout
9.1
Typical Application
9.1.1
Schematic
10
Device and Documentation Support
10.1
Getting Started and Next Steps
10.2
Device Nomenclature
10.3
Tools and Software
10.4
Documentation Support
10.5
Support Resources
10.6
Trademarks
10.7
Electrostatic Discharge Caution
10.8
Glossary
11
Mechanical, Packaging, and Orderable Information
12
Revision History
IMPORTANT NOTICE
Package Options
Mechanical Data (Package|Pins)
PM|64
MTQF008B
PT|48
MTQF003C
RGE|24
MPQF124G
DGS|28
MPSS139
RGZ|48
MPQF123F
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
RGE|24
QFND136Y
RGZ|48
QFND014T
RHB|32
QFND029X
Orderable Information
slasf11c_oa
slasf11c_pm
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MSPM0G110x
Mixed-Signal Microcontrollers