SLASF11C February   2023  – October 2023 MSPM0G1106 , MSPM0G1107

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 GPAMP
      1. 7.15.1 Electrical Characteristics
      2. 7.15.2 Switching Characteristics
    16. 7.16 I2C
      1. 7.16.1 I2C Timing Diagram
      2. 7.16.2 I2C Characteristics
      3. 7.16.3 I2C Filter
    17. 7.17 SPI
      1. 7.17.1 SPI
      2. 7.17.2 SPI Timing Diagram
    18. 7.18 UART
    19. 7.19 TIMx
    20. 7.20 Emulation and Debug
      1. 7.20.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G110x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 GPAMP
    16. 8.16 CRC
    17. 8.17 UART
    18. 8.18 I2C
    19. 8.19 SPI
    20. 8.20 WWDT
    21. 8.21 RTC
    22. 8.22 Timers (TIMx)
    23. 8.23 Device Analog Connections
    24. 8.24 Input/Output Diagrams
    25. 8.25 Serial Wire Debug Interface
    26. 8.26 Bootstrap Loader (BSL)
    27. 8.27 Device Factory Constants
    28. 8.28 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 Device Comparison
DEVICE NAME (1)(4) FLASH / SRAM (KB) QUAL(2) ADC / CHAN GPAMP UART / I2C / SPI TIMA TIMG GPIO PACKAGE
[PACKAGE SIZE] (3)
MSPM0G1106xPM 64 / 32 T 2 / 17 1 4 / 2 / 2 2 5 60 64 LQFP
[12 mm × 12 mm]
MSPM0G1107xPM 128 / 32
MSPM0G1105xPT 32 / 16 T 2 / 16 1 4 / 2 / 2 2 5 44 48 LQFP
[9 mm × 9 mm]
MSPM0G1106xPT 64 / 32
MSPM0G1107xPT 128 / 32
MSPM0G1105xRGZ 32 / 16 T 2 / 16 1 4 / 2 / 2 2 5 44 48 VQFN
[7 mm × 7 mm]
MSPM0G1106xRGZ 64 / 32
MSPM0G1107xRGZ 128 / 32
MSPM0G1106xRHB 64 / 32 T 2 / 11 1 4 / 2 / 2 2 5 28 32 VQFN
[5 mm × 5 mm]
MSPM0G1107xRHB 128 / 32
MSPM0G1107xDGS28 128 / 32 T 2 / 11 1 4 / 2 / 2 2 5 24 28 VSSOP
[7.1 mm × 4.9 mm]
MSPM0G1107xRGE 128 / 32 T 2 / 9 1 4 / 2 / 2 2 5 20 24 VQFN
[4 mm × 4 mm]
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 11, or see the TI website.
(2) Device Qualifications:
  • T = –40°C to 105°C
(3) The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see Section 11.
(4) For more information about the device name, see Section 10.2.