SLASF11C February   2023  – October 2023 MSPM0G1106 , MSPM0G1107

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 GPAMP
      1. 7.15.1 Electrical Characteristics
      2. 7.15.2 Switching Characteristics
    16. 7.16 I2C
      1. 7.16.1 I2C Timing Diagram
      2. 7.16.2 I2C Characteristics
      3. 7.16.3 I2C Filter
    17. 7.17 SPI
      1. 7.17.1 SPI
      2. 7.17.2 SPI Timing Diagram
    18. 7.18 UART
    19. 7.19 TIMx
    20. 7.20 Emulation and Debug
      1. 7.20.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G110x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 GPAMP
    16. 8.16 CRC
    17. 8.17 UART
    18. 8.18 I2C
    19. 8.19 SPI
    20. 8.20 WWDT
    21. 8.21 RTC
    22. 8.22 Timers (TIMx)
    23. 8.23 Device Analog Connections
    24. 8.24 Input/Output Diagrams
    25. 8.25 Serial Wire Debug Interface
    26. 8.26 Bootstrap Loader (BSL)
    27. 8.27 Device Factory Constants
    28. 8.28 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.14.2 Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IVREF VREF operating supply current BUFCONFIG = {0, 1}, No load 166 330 µA
IDrive VREF output drive strength (1) Drive strength supported on VREF+ device pin 100 µA
ISC VREF short circuit current 100 mA
TCVREF Temperature coefficient of VREF (Bandgap+VRBUF) (3) BUFCONFIG = {1} BUFCONFIG = {1} 75 ppm/°C
TCVREF Temperature coefficient of VREF (Bandgap+VRBUF) (3) BUFCONFIG = {0} BUFCONFIG = {0} 75 ppm/°C
TCdrift Long term VREF drift Time = 1000 hours, BUFCONFIG = {0, 1}, T = 25℃ 300 ppm
PSRRDC VREF Power supply rejection ratio, DC VDD = 1.7 V to VDDmax, BUFCONFIG = 1 -57 -63 dB
VDD = 2.7 V to VDDmax, BUFCONFIG = 0 -49 -53
Vnoise RMS noise at VREF output (0.1 Hz to 100 MHz) BUFCONFIG = 1 500 µVrms
BUFCONFIG = 0 900
CVREF Recommended VREF decoupling capacitor on VREF+ pin (3) (4) (5) 0.7 1 1.15 µF
Tstartup VREF startup time BUFCONFIG = {0, 1} , VDD = 2.8 V, CVREF = 1µF 200 µS
Trefresh VREF External capacitor refresh time 31.25
(1) The specified MAX output drive strength is supported regardless of which peripherals are being used in the device.
(2) The temperature coefficient of the VREF output is the sum of TCVRBUF and the temperature coefficient of the internal bandgap reference.
(3) Decoupling capacitor (CVREF) is required when using the internal voltage reference VREF and should be connected from the VREF+ pin to VREF-/GND. When using the VREF+/- pins to supply an external reference, a decoupling capacitor value should be selected based on the external reference source.
(4) A ceramic capacitor with package size of 0805 or smaller is preferred. Up to ±20% tolerance is acceptable
(5) The VREF module should only be enabled when CVREF is connected and should not be enabled otherwise.