SLASF94A May   2024  – October 2024 MSPM0L1227 , MSPM0L1228 , MSPM0L2227 , MSPM0L2228

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  VBat Characteristics
    8. 7.8  Flash Memory Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Clock Specifications
      1. 7.10.1 System Oscillator (SYSOSC)
      2. 7.10.2 Low Frequency Oscillator (LFOSC)
      3. 7.10.3 Low Frequency Crystal/Clock
      4. 7.10.4 High Frequency Crystal/Clock
    11. 7.11 Digital IO
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
    12. 7.12 Analog Mux VBOOST
    13. 7.13 ADC
      1. 7.13.1 Electrical Characteristics
      2. 7.13.2 Switching Characteristics
      3. 7.13.3 Linearity Parameters
      4. 7.13.4 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Electrical Characteristics ADC
      2. 7.15.2 Electrical Characteristics (Comparator)
      3. 7.15.3 Voltage Characterisitcs (ADC)
      4. 7.15.4 Voltage Characterisitcs (Comparator)
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 LCD
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 TRNG
      1. 7.22.1 TRNG Electrical Characteristics
      2. 7.22.2 TRNG Switching Characteristics
    23. 7.23 Emulation and Debug
      1. 7.23.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Lx22x)
    4. 8.4  Security
    5. 8.5  Power Management Unit (PMU)
    6. 8.6  Clock Module (CKM)
    7. 8.7  DMA
    8. 8.8  Events
    9. 8.9  Memory
      1. 8.9.1 Memory Organization
      2. 8.9.2 Peripheral File Map
      3. 8.9.3 Peripheral Interrupt Vector
    10. 8.10 Flash Memory
    11. 8.11 SRAM
    12. 8.12 GPIO
    13. 8.13 IOMUX
    14. 8.14 ADC
    15. 8.15 Temperature Sensor
    16. 8.16 LFSS
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 TRNG
    20. 8.20 AESADV
    21. 8.21 Keystore
    22. 8.22 CRC
    23. 8.23 UART
    24. 8.24 I2C
    25. 8.25 SPI
    26. 8.26 IWDT
    27. 8.27 WWDT
    28. 8.28 RTC_A
    29. 8.29 Timers (TIMx)
    30. 8.30 LCD
    31. 8.31 Device Analog Connections
    32. 8.32 Input/Output Diagrams
    33. 8.33 Serial Wire Debug Interface
    34. 8.34 Bootstrap Loader (BSL)
    35. 8.35 Device Factory Constants
    36. 8.36 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PM|64
  • RGE|24
  • PT|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

MSPM0Lx22x microcontrollers (MCUs) are part of the highly integrated, ultra-low-power 32-bit MSPM0 MCU family based on the Arm® Cortex®-M0+ 32-bit core platform, operating at up to 32MHz frequency. These MCUs offer a blend of cost optimization and design flexibility for applications requiring 128KB to 256KB of flash memory in small packages (down to 4mm x 4mm) or high pin count packages (up to 80 pins). These devices include a VBAT backup island, an optional segmented LCD controller (on MSPM0L222x), cybersecurity enablers, and high-performance integrated analog, and provide excellent low-power performance across the operating temperature range.

Up to 256KB of embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with ECC and parity protection is provided. The flash memory is organized into two main banks to support field firmware updates, with address swap support provided between the two main banks. An additional 32-byte backup memory is provided in the VBAT island, supplied by the VBAT pin and retained even when the main supply (VDD) is lost.

The VBAT island provides a fully independent auxiliary power domain (separate from the main supply) which supplies low frequency modules from an alternate supply such as a battery, supercapacitor, or alternate voltage level (1.62V to 3.6V). The VBAT island includes the low-frequency clock system (LFOSC, LFXT), the real-time clock, the tamper detection, and timestamp logic, an independent watchdog timer, and a 32-byte backup memory. Up to five digital IOs are powered from the VBAT supply. A charging mode is provided to optionally trickle charge a supercapacitor on the VBAT pin from the primary (VDD) supply when VDD is greater than VBAT.

An ultra-low power segmented LCD controller (on MSPM0L2228 and MSPM0L2227 devices) supports driving LCD glass with up to 59 pins in a variety of mux and bias configurations, enabling low cost displays.

Flexible cybersecurity enablers can be used to support secure boot, secure in-field firmware updates, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of AES symmetric cipher modes, as well as a TRNG entropy source. The cybersecurity architecture is Arm® PSA Level 1 certified.

A set of high-performance analog modules is provided, including a 12-bit 1.68Msps SAR ADC supporting up to 26 external channels. An analog comparator is provided to support low power or low latency monitoring of analog signals. An on-chip voltage reference (1.4V or 2.5V) can be used to provide a stable reference voltage to the ADC and comparator. Environmental monitoring of the die temperature using the internal temperature sensor, VDD voltage, and VBAT voltage is supported.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project's needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0Lx22x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32MHz Microcontrollers Technical Reference Manual.

CAUTION:

System-level ESD protection must be applied in compliance with the device-level ESD specification to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level ESD Considerations for more information. The principles in this application note are applicable to MSPM0 MCUs.

Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
MSPM0L2228SPN PN (LQFP, 80) 14mm x 14mm
MSPM0L2227SPN
MSPM0L1228SPN
MSPM0L1227SPN
MSPM0L2228SPM PM (LQFP, 64) 12 mm x 12 mm
MSPM0L2227SPM
MSPM0L1228SPM
MSPM0L1227SPM
MSPM0L2228SPT PT (LQFP, 48) 9mm x 9mm
MSPM0L2227SPT
MSPM0L1228SPT
MSPM0L1227SPT
MSPM0L2228SRGZ RGZ (VQFN, 48) 7mm x 7mm
MSPM0L2227SRGZ
MSPM0L1228SRGZ
MSPM0L1227SRGZ
MSPM0L1228SRHB RHB (VQFN, 32) 5mm x 5mm
MSPM0L1227SRHB
MSPM0L1228SRGE RGE (VQFN, 24) 4mm x 4mm
MSPM0L1227SRGE
(1) For more information, see Section 12.
(2) The package size (length x width) is a nominal value and includes pins, where applicable