SLASF94A May   2024  – October 2024 MSPM0L1227 , MSPM0L1228 , MSPM0L2227 , MSPM0L2228

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  VBat Characteristics
    8. 7.8  Flash Memory Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Clock Specifications
      1. 7.10.1 System Oscillator (SYSOSC)
      2. 7.10.2 Low Frequency Oscillator (LFOSC)
      3. 7.10.3 Low Frequency Crystal/Clock
      4. 7.10.4 High Frequency Crystal/Clock
    11. 7.11 Digital IO
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
    12. 7.12 Analog Mux VBOOST
    13. 7.13 ADC
      1. 7.13.1 Electrical Characteristics
      2. 7.13.2 Switching Characteristics
      3. 7.13.3 Linearity Parameters
      4. 7.13.4 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Electrical Characteristics ADC
      2. 7.15.2 Electrical Characteristics (Comparator)
      3. 7.15.3 Voltage Characterisitcs (ADC)
      4. 7.15.4 Voltage Characterisitcs (Comparator)
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 LCD
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 TRNG
      1. 7.22.1 TRNG Electrical Characteristics
      2. 7.22.2 TRNG Switching Characteristics
    23. 7.23 Emulation and Debug
      1. 7.23.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Lx22x)
    4. 8.4  Security
    5. 8.5  Power Management Unit (PMU)
    6. 8.6  Clock Module (CKM)
    7. 8.7  DMA
    8. 8.8  Events
    9. 8.9  Memory
      1. 8.9.1 Memory Organization
      2. 8.9.2 Peripheral File Map
      3. 8.9.3 Peripheral Interrupt Vector
    10. 8.10 Flash Memory
    11. 8.11 SRAM
    12. 8.12 GPIO
    13. 8.13 IOMUX
    14. 8.14 ADC
    15. 8.15 Temperature Sensor
    16. 8.16 LFSS
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 TRNG
    20. 8.20 AESADV
    21. 8.21 Keystore
    22. 8.22 CRC
    23. 8.23 UART
    24. 8.24 I2C
    25. 8.25 SPI
    26. 8.26 IWDT
    27. 8.27 WWDT
    28. 8.28 RTC_A
    29. 8.29 Timers (TIMx)
    30. 8.30 LCD
    31. 8.31 Device Analog Connections
    32. 8.32 Input/Output Diagrams
    33. 8.33 Serial Wire Debug Interface
    34. 8.34 Bootstrap Loader (BSL)
    35. 8.35 Device Factory Constants
    36. 8.36 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PM|64
  • RGE|24
  • RHB|32
  • RGZ|48
  • PN|80
  • PT|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.36 Identification

Revision and Device Identification

The hardware revision and device identification values are stored in the memory-mapped FACTORY region, refer to Device Factory Constants section, which provides read-only data describing the capabilities of a device as well as any factory-provided trim information for use by application software. Refer to the Factory Constants chapter of the MSPM0 L-Series 32MHz Microcontrollers Technical Reference Manual for more information.

The device revision and identification information are also included as part of the top-side marking on the device package. The device-specific errata sheet describes these markings (see Section 10.4).