SLASF94A May 2024 – October 2024 MSPM0L1227 , MSPM0L1228 , MSPM0L2227 , MSPM0L2228
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | PACKAGE | VALUE | UNIT | |
---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance | LQFP-80 (PN) | 60.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 20.5 | °C/W | |
RθJB | Junction-to-board thermal resistance | 40.3 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 1.1 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 39.7 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance | LQFP-64 (PM) | 63.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 23.8 | °C/W | |
RθJB | Junction-to-board thermal resistance | 35.3 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 2.2 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 35 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance | VQFN-48 (RGZ) | 30.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 20.7 | °C/W | |
RθJB | Junction-to-board thermal resistance | 12.5 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 12.4 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.2 | °C/W | |
RθJA | Junction-to-ambient thermal resistance | LQFP-48 (PT) | 69.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 27.4 | °C/W | |
RθJB | Junction-to-board thermal resistance | 32.6 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 2.6 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 32.3 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance | VQFN-32 (RHB) | 32.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 23.6 | °C/W | |
RθJB | Junction-to-board thermal resistance | 13.0 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 13.0 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.3 | °C/W | |
RθJA | Junction-to-ambient thermal resistance | VQFN-24 (RGE) | 44.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 38.1 | °C/W | |
RθJB | Junction-to-board thermal resistance | 21.9 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 1.1 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 21.9 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.1 | °C/W |