SLASF59A May   2023  – December 2023 MSPM0L1304-Q1 , MSPM0L1305-Q1 , MSPM0L1306-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 COMP
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 GPAMP
      1. 7.16.1 Electrical Characteristics
      2. 7.16.2 Switching Characteristics
    17. 7.17 OPA
      1. 7.17.1 Electrical Characteristics
      2. 7.17.2 Switching Characteristics
      3. 7.17.3 PGA Mode
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 CRC
    17. 8.17 GPAMP
    18. 8.18 OPA
    19. 8.19 I2C
    20. 8.20 SPI
    21. 8.21 UART
    22. 8.22 WWDT
    23. 8.23 Timers (TIMx)
    24. 8.24 Device Analog Connections
    25. 8.25 Input/Output Diagrams
    26. 8.26 Serial Wire Debug Interface
    27. 8.27 Bootstrap Loader (BSL)
    28. 8.28 Device Factory Constants
    29. 8.29 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|28
  • DYY|16
  • RGE|24
  • RHB|32
  • DGS|32
  • DGS|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Tools and Software

Design Kits and Evaluation Modules

    MSPM0 LaunchPad Development Kit: LP-MSPM0L1306 Empowers you to immediately start developing on the industry’s best integrated analog and most cost-optimized general purpose MSPM0 MCU family. Exposes all device pins and functionality; includes some built-in circuitry, out-of-box software demos, and on-board XDS110 debug probe for programming, debugging, and EnergyTrace™ technology. The LaunchPad ecosystem includes dozens of BoosterPack™ stackable plug-in modules to extend functionality.
    Embedded Software
    MSPM0 Software Development Kit (SDK)

    Contains software drivers, middleware libraries, documentation, tools, and code examples that create a familiar and easy user experience for all MSPM0 devices.
    Software Development Tools
    TI Cloud Tools Start your evaluation and development on a web browser without any installation. Cloud tools also have a downloadable, offline version.
    SysConfig Intuitive GUI to configure device and peripherals, resolve system conflicts, generate configuration code, and automate pin mux settings. Accessible in CCS IDE or in TI Cloud Tools. (offline version)
    MSP Academy Great starting point for all developers to learn about the MSPM0 MCU Platform with training modules that span a wide range of topics. Part of TIRex.
    GUI Composer GUIs that simplify evaluation of certain MSPM0 features, such as configuring and monitoring a fully integrated analog signal chain without any code needed.
    IDE and compiler tool chains
    Code Composer Studio™ (CCS) Includes TI Arm-Clang compiler. Supports all TI Arm Cortex MCUs and boasts competitive code size performance advantages, fast compile time, code coverage support, safety certification support, and completely free to use.