SLASF59A May   2023  – December 2023 MSPM0L1304-Q1 , MSPM0L1305-Q1 , MSPM0L1306-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 COMP
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 GPAMP
      1. 7.16.1 Electrical Characteristics
      2. 7.16.2 Switching Characteristics
    17. 7.17 OPA
      1. 7.17.1 Electrical Characteristics
      2. 7.17.2 Switching Characteristics
      3. 7.17.3 PGA Mode
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 CRC
    17. 8.17 GPAMP
    18. 8.18 OPA
    19. 8.19 I2C
    20. 8.20 SPI
    21. 8.21 UART
    22. 8.22 WWDT
    23. 8.23 Timers (TIMx)
    24. 8.24 Device Analog Connections
    25. 8.25 Input/Output Diagrams
    26. 8.26 Serial Wire Debug Interface
    27. 8.27 Bootstrap Loader (BSL)
    28. 8.28 Device Factory Constants
    29. 8.29 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|28
  • DYY|16
  • RGE|24
  • RHB|32
  • DGS|32
  • DGS|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Functionality by Operating Mode

Supported functionality in each operating mode is given in Table 8-1.

Functional key:

  • EN: The function is enabled in the specified mode.
  • DIS: The function is disabled (either clock or power gated) in the specified mode, but the function's configuration is retained.
  • OPT: The function is optional in the specified mode, and remains enabled if configured to be enabled.
  • NS: The function is not automatically disabled in the specified mode, but its use is not supported.
  • OFF: The function is fully powered off in the specified mode, and no configuration information is retained.
Table 8-1 Supported Functionality by Operating Mode
Operating Mode RUN SLEEP STOP STANDBY SHUTDOWN
RUN0 RUN1 RUN2 SLEEP0 SLEEP1 SLEEP2 STOP0 STOP1 STOP2 STANDBY0 STANDBY1
Oscillators SYSOSC EN EN DIS EN EN DIS OPT(1) EN DIS DIS DIS OFF
LFOSC EN OFF
Clocks CPUCLK 32M 32k 32k DIS OFF
MCLK to PD1 32M 32k 32k 32M 32k 32k DIS OFF
ULPCLK to PD0 32M 32k 32k 32M 32k 32k 4M(1) 4M 32k DIS OFF
ULPCLK to TIMG0/1 32M 32k 32k 32M 32k 32k 4M(1) 4M 32k OFF
MFCLK OPT DIS OPT DIS OPT DIS OFF
LFCLK 32k DIS OFF
LFCLK to TIMG0/1 32k OFF
MCLK Monitor OPT DIS OFF
PMU POR Monitor EN
BOR Monitor EN OFF
Core Regulator FULL DRIVE REDUCED DRIVE LOW DRIVE OFF
Core Functions CPU EN DIS OFF
DMA OPT NS (triggers supported) OFF
Flash EN DIS OFF
SRAM EN DIS OFF
PD1 Peripherals SPI0 OPT DIS OFF
CRC OPT DIS OFF
PD0 Peripherals TIMG0/1 OPT OFF
TIMG2/4 OPT OPT(2) OFF
UART0/1 OPT OPT(2) OFF
I2C0/1 OPT OPT(2) OFF
GPIOA OPT OPT(2) OFF
WWDT0 OPT DIS OFF
Analog ADC0 OPT NS (triggers supported) OFF
OPA0/1 OPT NS OPT NS OPT NS OFF
GPAMP OPT NS OFF
COMP0 OPT OPT (ULP) OPT OPT (ULP) OPT OPT (ULP) OFF
IOMUX and IO Wakeup EN DIS w/ WAKE
Wake Sources N/A ANY IRQ PD0 IRQ IOMUX, NRST, SWD
(1) If STOP0 is entered from RUN1 (SYSOSC enabled but MCLK sourced from LFCLK), SYSOSC remains enabled as in RUN1 and ULPCLK remains at 32 kHz as in RUN1. If STOP0 is entered from RUN2 (SYSOSC was disabled and MCLK was sourced from LFCLK), SYSOSC remains disabled as in RUN2 and ULPCLK remains at 32 kHz as in RUN2.
(2) When using the STANDBY1 policy for STANDBY, only TIMG0 and TIMG1 are clocked. Other PD0 peripherals can generate an asynchronous fast clock request upon external activity but are not actively clocked.