SLASEX0D October   2022  – January 2024 MSPM0L1303 , MSPM0L1304 , MSPM0L1305 , MSPM0L1306 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 COMP
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 GPAMP
      1. 7.16.1 Electrical Characteristics
      2. 7.16.2 Switching Characteristics
    17. 7.17 OPA
      1. 7.17.1 Electrical Characteristics
      2. 7.17.2 Switching Characteristics
      3. 7.17.3 PGA Mode
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 CRC
    17. 8.17 GPAMP
    18. 8.18 OPA
    19. 8.19 I2C
    20. 8.20 SPI
    21. 8.21 UART
    22. 8.22 WWDT
    23. 8.23 Timers (TIMx)
    24. 8.24 Device Analog Connections
    25. 8.25 Input/Output Diagrams
    26. 8.26 Serial Wire Debug Interface
    27. 8.27 Bootstrap Loader (BSL)
    28. 8.28 Device Factory Constants
    29. 8.29 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.17.1 Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCM Common mode voltage range RRI = 0x0 -0.1 VDD-1.1 V
RRI = 0x1 -0.1 VDD-0.3
VO Voltage output swing from rail range RL = 10kΩ connected to VDD/2 20 68 mV
Iq Quiescent current, per op-amp (3) IO= 0mA, RRI = 0x0 GBW = 0x0 100 µA
GBW = 0x1 350
IO= 0mA, RRI = 0x1 GBW = 0x0 140 170
GBW = 0x1 450 600
IBCS Burn-out current source current  2 µA
GBW Gain-bandwidth product Noninverting, unity gain,CL = 40 pF GBW = 0x0 1.5 MHz
GBW = 0x1 6
VOS Input offset voltage Noninverting, unity gain, VDD = 3.3V, TA = 25°C CHOP = 0x0 ±0.4 ±2 mV
CHOP = 0x1 or 0x2 ±0.3
Noninverting, unity gain, VDD = 3.3V CHOP = 0x0 ±1.5 ±3.5
CHOP = 0x1 or 0x2 ±0.1 ±0.5
dVOS/dT Input offset voltage temperature drift Noninverting, unity gain, CHOP = 0x0 GBW = 0x0 ±8.5 µV/°C
GBW = 0x1 ±6
Noninverting, unity gain, CHOP = 0x1 or 0x2 ±0.5
PSRRDC Power Supply Rejection Ratio, DC Noninverting, unity gain CHOP = 0x0 74 86 dB
CHOP = 0x1 or 0x2 74 86
Ibias Input bias current 0.1V<Vin<VDD-0.3V, VDD = 3.3V, CHOP=0x0 TA = 25°C ±50 pA
TA = 125°C ±0.35 ±100 nA
0.1V<Vin<VDD-0.3V, VDD = 3.3V, CHOP=0x1 TA = 25°C ±0.4 nA
TA = 125°C ±0.4 ±104 nA
Ibias Input bias current for dedicated OPA input pin (1) 0.1V<Vin<VDD-0.3V, VDD = 3.3V, CHOP=0x0 TA = 25°C ±6 pA
TA = 125°C ±0.35 ±0.4 nA
0.1V<Vin<VDD-0.3V, VDD = 3.3V, CHOP=0x1 TA = 25°C ±0.4 nA
TA = 125°C ±0.4 ±0.5 nA
CMRRDC Common mode rejection ratio, DC RRI = 0x0: 0V<VCM<VDD-1.1V
RRI = 0x1: 0V<VCM<VDD-0.3V		 CHOP = 0x0 89 dB
CHOP = 0x1 or 0x2 73 102
en Input voltage noise density GBW = 0x0, Noninverting, unity gain, CHOP = 0x0 f = 1kHz 240 nV/√Hz
f = 10kHz 88
Rin Input resistance (2) 2.6 kΩ
Cin Input capacitance Common mode 3 pF
AOL Open-loop voltage gain, DC RL = 20kΩ to GND, 0.3<Vo<VDD-0.3 105 dB
PM phase margin CL = 40pF GBW = 0x0 57 degree
GBW = 0x1 50
SR Slew rate Noninverting, unity gain, CL = 40 pF GBW = 0x0 1.3 V/µs
GBW = 0x1 4.9
THDN Total harmonic distortion + noise Noninverting, unity gain, GBW = 0x0, f = 1.5kHz, Integration BW = 100kHz 0.0034 %
Noninverting, unity gain, GBW = 0x1, f = 6kHz, Integration BW = 100kHz 0.004
ILoad Short circuit current GBW = 0x0, TA = 25°C ±9 mA
GBW = 0x1, TA = 25°C ±30
CLoad Output load capacitance 40 pF
(1) MSPM0L134x devices only
(2) Rin here means the input resistance of mux in OPA.
(3) Excluding VBOOST current.  VBOOST must be enabled when OPA is enabled.