SBOS705D January   2016  – Feburary 2019 MUX36D04 , MUX36S08

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Leakage Current vs Temperature
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: MUX36S08
    2.     Pin Functions: MUX36D04
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Dual Supply
    6. 7.6 Electrical Characteristics: Single Supply
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  Truth Tables
    2. 8.2  On-Resistance
    3. 8.3  Off-Leakage Current
    4. 8.4  On-Leakage Current
    5. 8.5  Differential On-Leakage Current
    6. 8.6  Transition Time
    7. 8.7  Break-Before-Make Delay
    8. 8.8  Turn-On and Turn-Off Time
    9. 8.9  Charge Injection
    10. 8.10 Off Isolation
    11. 8.11 Channel-to-Channel Crosstalk
    12. 8.12 Bandwidth
    13. 8.13 THD + Noise
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Ultralow Leakage Current
      2. 9.3.2 Ultralow Charge Injection
      3. 9.3.3 Bidirectional Operation
      4. 9.3.4 Rail-to-Rail Operation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

MUX36S08: PW Package
16-Pin TSSOP
Top View
MUX36S08: RUM and RRJ Package
16-Pin WQFN
Top View
RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.

Pin Functions: MUX36S08

PIN FUNCTION DESCRIPTION
NAME TSSOP WQFN
A0 1 15 Digital input Address line 0
A1 16 14 Digital input Address line 1
A2 15 13 Digital input Address line 2
D 8 6 Analog input or output Drain pin. Can be an input or output.
EN 2 16 Digital input Active high digital input. When this pin is low, all switches are turned off. When this pin is high, the A[2:0] logic inputs determine which switch is turned on.
GND 14 12 Power supply Ground (0 V) reference
S1 4 2 Analog input or output Source pin 1. Can be an input or output.
S2 5 3 Analog input or output Source pin 2. Can be an input or output.
S3 6 4 Analog input or output Source pin 3. Can be an input or output.
S4 7 5 Analog input or output Source pin 4. Can be an input or output.
S5 12 10 Analog input or output Source pin 5. Can be an input or output.
S6 11 9 Analog input or output Source pin 6. Can be an input or output.
S7 10 8 Analog input or output Source pin 7. Can be an input or output.
S8 9 7 Analog input or output Source pin 8. Can be an input or output.
VDD 13 11 Power supply Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
VSS 3 1 Power supply Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND.
Thermal Pad(1) - - Power supply Exposed Pad. The exposed pad is electrically connected to VSS internally. Connect EP to VSS to achieve rated thermal and ESD performance.
(1) RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.
MUX36D04: PW Package
16-Pin TSSOP
Top View
MUX36D04: RUM and RRJ Package
16-Pin WQFN
Top View
RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.

Pin Functions: MUX36D04

PIN FUNCTION DESCRIPTION
NAME TSSOP WQFN
A0 1 15 Digital input Address line 0
A1 16 14 Digital input Address line 1
DA 8 6 Analog input or output Drain pin A. Can be an input or output.
DB 9 7 Analog input or output Drain pin B. Can be an input or output.
EN 2 16 Digital input Active high digital input. When this pin is low, all switches are turned off. When this pin is high, the A[1:0] logic inputs determine which pair of switches is turned on.
GND 15 13 Power supply Ground (0 V) reference
S1A 4 2 Analog input or output Source pin 1A. Can be an input or output.
S2A 5 3 Analog input or output Source pin 2A. Can be an input or output.
S3A 6 4 Analog input or output Source pin 3A. Can be an input or output.
S4A 7 5 Analog input or output Source pin 4A. Can be an input or output.
S1B 13 11 Analog input or output Source pin 1B. Can be an input or output.
S2B 12 10 Analog input or output Source pin 2B. Can be an input or output.
S3B 11 9 Analog input or output Source pin 3B. Can be an input or output.
S4B 10 8 Analog input or output Source pin 4B. Can be an input or output.
VDD 14 12 Power supply Positive power supply. This pin is the most positive power supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
VSS 3 1 Power supply Negative power supply. This pin is the most negative power supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND.
Thermal Pad(1) - - Power supply Exposed Pad. The exposed pad is electrically connected to VSS internally. Connect EP to VSS to achieve rated thermal and ESD performance.
(1) RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.