SLLSEK1B July   2014  – March 2018 ONET2804T

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Eye Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Bond Pad Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 DC Electrical Characteristics
    5. 6.5 AC Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Signal Path
      2. 7.3.2 Gain Adjustment
      3. 7.3.3 Amplitude Adjustment
      4. 7.3.4 Rate Select
      5. 7.3.5 Threshold Adjustment
      6. 7.3.6 Filter Circuitry
      7. 7.3.7 AGC and RSSI
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pad Control
      2. 7.4.2 2-Wire Interface Control
      3. 7.4.3 2-Wire Interface and Control Logic
      4. 7.4.4 Bus Idle
      5. 7.4.5 Start Data Transfer
      6. 7.4.6 Stop Data Transfer
      7. 7.4.7 Data Transfer
      8. 7.4.8 Acknowledge
    5. 7.5 Register Maps
      1. 7.5.1  Register 0 (0x00) – Control Settings (offset = 0h) [reset = 0h]
        1. Table 2. Register 0 (0x00) – Control Settings Field Descriptions
      2. 7.5.2  Register 1 (0x01) – Amplitude and Rate for Channel 1 (offset = 1h) [reset = 0h]
        1. Table 3. Register 1 (0x01) – Amplitude and Rate for Channel 1 Field Descriptions
      3. 7.5.3  Register 2 (0x02) Mapping – Threshold and Gain for Channel 1 (offset = 2h) [reset = 0h]
        1. Table 4. Register 2 (0x02) – Threshold and Gain for Channel 1
      4. 7.5.4  Register 3 (0x03) – Reserved
        1. Table 5. Register 3 (0x03) – Reserved Field Descriptions
      5. 7.5.5  Register 4 (0x04) – Reserved
        1. Table 6. Register 4 (0x04) – Reserved Field Descriptions
      6. 7.5.6  Register 5 (0x05) – Reserved
        1. Table 7. Register 5 (0x05) – Reserved Field Descriptions
      7. 7.5.7  Register 6 (0x06) – Reserved
        1. Table 8. Register 6 (0x06) – Reserved Field Descriptions
      8. 7.5.8  Register 7 (0x07) – Amplitude and Rate for Channel 2 (offset = 7h) [reset = 0h]
        1. Table 9. Register 7 (0x07) – Amplitude and Rate for Channel 2 Field Descriptions
      9. 7.5.9  Register 8 (0x08) Mapping – Threshold and Gain for Channel 1 (offset = 8h) [reset = 0h]
        1. Table 10. Register 8 (0x08) – Threshold and Gain for Channel 2
      10. 7.5.10 Register 9 (0x09) – Reserved
        1. Table 11. Register 9 (0x09) – Reserved Field Descriptions
      11. 7.5.11 Register 10 (0x0A) – Reserved
        1. Table 12. Register 10 (0x0A) – Reserved Field Descriptions
      12. 7.5.12 Register 11 (0x0B) – Reserved
        1. Table 13. Register 11 (0x0B) – Reserved Field Descriptions
      13. 7.5.13 Register 12 (0x0C) – Reserved
        1. Table 14. Register 12 (0x0C) – Reserved Field Descriptions
      14. 7.5.14 Register 13 (0x0D) – Amplitude and Rate for Channel 3 (offset = Dh) [reset = 0h]
        1. Table 15. Register 13 (0x0D) – Amplitude and Rate for Channel 3 Field Descriptions
      15. 7.5.15 Register 14 (0x0E) Mapping – Threshold and Gain for Channel 3 (offset = Eh) [reset = 0h]
        1. Table 16. Register 14 (0x0E) – Threshold and Gain for Channel 3
      16. 7.5.16 Register 15 (0x0F) – Reserved
        1. Table 17. Register 15 (0x0F) – Reserved Field Descriptions
      17. 7.5.17 Register 16 (0x10) – Reserved
        1. Table 18. Register 16 (0x10) – Reserved Field Descriptions
      18. 7.5.18 Register 17 (0x11) – Reserved
        1. Table 19. Register 17 (0x11) – Reserved Field Descriptions
      19. 7.5.19 Register 18 (0x12) – Reserved
        1. Table 20. Register 18 (0x12) – Reserved Field Descriptions
      20. 7.5.20 Register 19 (0x13) – Amplitude and Rate for Channel 4 (offset = 13h ) [reset = 0h]
        1. Table 21. Register 19 (0x13) – Amplitude and Rate for Channel 4 Field Descriptions
      21. 7.5.21 Register 20 (0x14) Mapping – Threshold and Gain for Channel 4 (offset =14h) [reset = 0h]
        1. Table 22. Register 20 (0x14) – Threshold and Gain for Channel 4
      22. 7.5.22 Register 21 (0x15) – Reserved
        1. Table 23. Register 21 (0x15) – Reserved Field Descriptions
      23. 7.5.23 Register 22 (0x10) – Reserved
        1. Table 24. Register 21 (0x10) – Reserved Field Descriptions
      24. 7.5.24 Register 23 (0x17) – Reserved
        1. Table 25. Register 23 (0x17) – Reserved Field Descriptions
      25. 7.5.25 Register 24 (0x18) – Reserved
        1. Table 26. Register 24 (0x18) – Reserved Field Descriptions
      26. 7.5.26 Register 25 (0x19) – Reserved
        1. Table 27. Register 25 (0x19) – Reserved Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application, Pad Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application, 2-Wire Control
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • Y|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Careful attention to assembly parasitics and external components is necessary to achieve optimal performance.

  • Minimize the total capacitance on the IN pad by using a low capacitance photodiode (100fF) and paying attention to stray capacitances. Place the photodiode close to the ONET2804T die and keep the wire bond inductance in the range of 300 to 400pH.
  • Use identical termination and symmetrical transmission lines at the AC coupled differential output pins OUT+ and OUT–.
  • Use short bond wire connections for the supply terminals VCCIx, VCCOx and GND. Supply voltage filtering is provided on chip but filtering may be improved by using an additional external capacitor.
  • The die has backside metal and conductive epoxy must be used to attach the die to ground.