SBOS703F April   2014  – October 2016 OPA2316 , OPA316 , OPA4316

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA316
    5. 6.5 Thermal Information: OPA2316
    6. 6.6 Thermal Information: OPA2316S
    7. 6.7 Thermal Information: OPA4316
    8. 6.8 Electrical Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Input and ESD Protection
      4. 7.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5 EMI Susceptibility and Input Filtering
      6. 7.3.6 Rail-to-Rail Output
      7. 7.3.7 Capacitive Load and Stability
      8. 7.3.8 Overload Recovery
      9. 7.3.9 DFN Package
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Configurations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Amplifier Selection
        2. 8.2.2.2 Passive Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
      1. 10.6 Electrostatic Discharge Caution
      2. 10.7 Glossary
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (May 2016) to F Revision

  • Added SOIC (14) / OPA4316 body size information to Device Information table Go
  • Added D package to PW package pinout drawing Go
  • Added D (SOIC) thermal information to Thermal Information: OPA4316 table Go

Changes from D Revision (December 2014) to E Revision

  • Added new "RUG" packageGo

Changes from C Revision (October 2014) to D Revision

  • Added Shutdown section to Electrical Characteristics table Go
  • Added Related Documentation section Go

Changes from B Revision (August 2014) to C Revision

  • Updated devices and packages in Device Information table Go
  • Added thermal information for OPA2316S and OPA4316Go

Changes from A Revision (April 2014) to B Revision

  • Added OPA2316 to the Device Information tableGo
  • Added thermal information for OPA2316 Go
  • Added channel separation to Electrical Characteristics Go
  • Added GBP instead of UGB in the Electrical Characteristics Go
  • Added Channel Separation vs Frequency plotGo

Changes from * Revision (April 2014) to A Revision

  • Changed status from preview to production Go