SBOS079C March   1999  – February 2023 OPA2277 , OPA277 , OPA4277

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA277
    5. 6.5 Thermal Information: OPA2277
    6. 6.6 Thermal Information: OPA4277
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Offset Voltage Adjustment
      3. 7.3.3 Input Protection
      4. 7.3.4 Input Bias Current Cancellation
      5. 7.3.5 EMI Rejection Ratio (EMIRR)
        1. 7.3.5.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Second-Order, Low-Pass Filter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Load Cell Amplifier
      3. 8.2.3 Thermocouple Low-Offset, Low-Drift Loop Measurement With Diode Cold Junction Compensation
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 DRM Package (8-Pin VSON)
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI Reference Designs
        6. 9.1.1.6 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DRM|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (April 2015) to Revision C (February 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Applications bullets to include linksGo
  • Deleted text regarding identical specification for the single, dual, and quad versionsGo
  • Changed Offset Trim pin type from "Input" to "—"Go
  • Changed "DFN" to "DRM (VSON)" in OPA2277 Pin Functions tableGo
  • Added table note for 10-mA current limit on input pins in Absolute Maxiimum Ratings Go
  • Deleted operating temperature from Absolute Maximum Ratings Go
  • Deleted lead temperature from Absolute Maximum Ratings Go
  • Changed Thermal Information values for OPA2277 and OPA4277 SOIC packages.Go
  • Added test conditions to Electrical Characteristics headerGo
  • Changed format of Electrical Characteristcs for readabilityGo
  • Changed input offset voltage vs. time to long-term drift in Electrical Characteristics Go
  • Changed input bias current test condition to separate over temperature specificationGo
  • Deleted redundant row in open-loop gain parameterGo
  • Changed CLOAD to CL for consistencyGo
  • Changed Figure 6-14, Change in Input Bias Current vs Common-Mode Voltage, to correct typo in noteGo
  • Changed "DFN package" to "DRM package (8-pin VSON)"Go
  • Changed "DFN package" to "DRM Package" and added "8-Pin VSON"Go
  • Changed Development Support section to show updated links and resourcesGo

Changes from Revision A (April 2005) to Revision B (April 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go