SBOS309E August   2004  – December 2024 OPA2830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics VS = ±5V
    6. 6.6  Electrical Characteristics VS = 5V
    7. 6.7  Electrical Characteristics VS = 3V
    8. 6.8  Typical Characteristics: VS = ±5V
    9. 6.9  Typical Characteristics: VS = ±5V, Differential Configuration
    10. 6.10 Typical Characteristics: VS = 5V
    11. 6.11 Typical Characteristics: VS = 5V, Differential Configuration
    12. 6.12 Typical Characteristics: VS = 3V
    13. 6.13 Typical Characteristics: VS = 3V, Differential Configuration
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Wideband Voltage-Feedback Operation
      2. 8.1.2  Single-Supply ADC Interface
      3. 8.1.3  DC Level-Shifting
      4. 8.1.4  AC-Coupled Output Video Line Driver
      5. 8.1.5  Noninverting Amplifier With Reduced Peaking
      6. 8.1.6  Single-Supply Active Filter
      7. 8.1.7  Differential Low-Pass Active Filters
      8. 8.1.8  High-Pass Filters
      9. 8.1.9  High-Performance DAC Transimpedance Amplifier
      10. 8.1.10 Operating Suggestions Optimizing Resistor Values
      11. 8.1.11 Bandwidth vs Gain: Noninverting Operation
      12. 8.1.12 Inverting Amplifier Operation
      13. 8.1.13 Output Current and Voltages
      14. 8.1.14 Driving Capacitive Loads
      15. 8.1.15 Distortion Performance
      16. 8.1.16 Noise Performance
      17. 8.1.17 DC Accuracy and Offset Control
    2. 8.2 Power Supply Recommendations
      1. 8.2.1 Thermal Analysis
    3. 8.3 Layout
      1. 8.3.1 Board Layout Guidelines
        1. 8.3.1.1 Input and ESD Protection
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Design-In Tools
        1. 9.1.1.1 Demonstration Fixtures
        2. 9.1.1.2 Macro-model and Applications Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision D (August 2008) to Revision E (December 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Package Information table, Pin Functions table, ESD Ratings, Thermal Information, Recommended Operating Conditions, and Detailed Description sectionsGo
  • Updated electrical characteristics to match device performanceGo
  • Updated plots in Typical Characteristics Go
  • Updated thermal analysis with new θJA Go

Changes from Revision C (March 2006) to Revision D (August 2008)

  • Changed rating of storage temperature range in Absolute Maximum Ratings table from –40°C to +125°C to–65°C to +125°CGo

Changes from Revision B (February 2006) to Revision C (August 2008)

  • Changed differential input voltage to ±2.5V from ±1.2VGo