SBOS058B December   1997  – August 2024 OPA134 , OPA2134 , OPA4134

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - OPA134
    5. 5.5 Thermal Information - OPA2134
    6. 5.6 Thermal Information - OPA4134
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Total Harmonic Distortion
      2. 6.2.2 Distortion Measurements
      3. 6.2.3 Source Impedance and Distortion
      4. 6.2.4 Phase Reversal Protection
      5. 6.2.5 Output Current Limit
    3. 6.3 Functional Block Diagram
    4. 6.4 Device Functional Modes
      1. 6.4.1 Noise Performance
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Voltage
      2. 7.1.2 Offset Voltage Trim
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Analog Filter Designer
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 8.1.1.3 TI Reference Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6 Electrostatic Discharge Caution

OPA134 OPA2134 OPA4134 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.