SBOS771A December   2016  – January 2019 OPA4277-SP

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions: CFP
    2.     Pin Functions: CDIP
    3. 5.1 Bare Die Information
      1.      Bond Pad Coordinates in Microns
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection
      2. 7.3.2 Input Bias Current Cancellation
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) OPA4277-SP UNIT
CDIP (JDJ)
28 PINS
RθJA Junction-to-ambient thermal resistance 66.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 19.3 °C/W
RθJB Junction-to-board thermal resistance 26.8 °C/W
ψJT Junction-to-top characterization parameter 2.1 °C/W
ψJB Junction-to-board characterization parameter 26.2 °C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.