SBOS196I December   2001  – February 2024 OPA656

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics: High Grade DC Specifications
    7. 6.7 Typical Characteristics: VS = ±5 V
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Input and ESD Protection
    3. 7.3 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Wideband, Noninverting Operation
      2. 8.1.2 Wideband, Inverting Gain Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Demonstration Fixtures
        2. 8.4.1.2 Thermal Considerations
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision H (April 2015) to Revision I (February 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated Features, Applications, Description, Device Comparison Table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added Supply turn-on and turn-off rate, continuous input and output current specifications to Absolute Maximum Ratings TableGo
  • Updated footnote on Absolute Maximum Ratings table to add additional clarificationGo
  • Deleted Machine Model (MM) specification from ESD Ratings Table Go
  • Updated thermal specifications for D and DBV package in Thermal Information tableGo
  • Updated the test conditions to add additional clarity, updated the table format and deleted the Test Level column on Electrical Characteristics table.Go
  • Changed the test condition from TJ = 25°C to TA ≅ 25°C across Electrical Characteristics sectionGo
  • Updated the Electrical Characteristics AC performance section with improved typical small-signal bandwidth, 0.1 dB flatness, large-signal bandwidth, slew rate, voltage noise, and distortion parameters.Go
  • Deleted differential gain and differential phase parameter from Electrical Charactiristics sectionGo
  • Changed the input current noise at f = 100 kHz from 1.3 fA/√Hz to 5 fA/√HzGo
  • Updated the Electrical Characteristics DC Performance, Input, Output, and Power supply sections with improved typical open loop gain, CMRR and PSRR parameters.Go
  • Deleted 0°C to +70°C conditions across Electrical Characteristics sectionGo
  • Changed input offset current maximum from ±10 pA to ±20 pAGo
  • Changed typical and maximum most negative input voltage for CMRR > 77 dB from –4.5 V and –4 V to –4.3 V and –3.9 V respectivelyGo
  • Changed maximum most negative input voltage at –40°C to +85°C for CMRR > 77 dB from –3.8 V to –3.7 VGo
  • Changed the typical common mode input impedance from 1012 || 0.7 to 1012 || 0.4Go
  • Changed the typical differential mode input impedance from 1012 || 2.8 to 1010 || 2.6Go
  • Changed minimum sourcing output current over –40°C to +85°C from 46 mA to 45 mAGo
  • Changed maximum sinking output current over –40°C to +85°C from –46 mA to –45 mAGo
  • Changed typical and maximum quiescent current from 14 mA to 15 mA and 16 mA to 16.7 mA respectivelyGo
  • Changed maximum quiescent current over –40°C to +85°C from 16.3 mA to 16.8 mAGo
  • Updated the High Grade DC Specifications section with improved typical CMRR and PSRR parameters.Go
  • Changed input bias current and input offset current maximum in High Grade DC Specifications section from ±5 pA to ±20 pAGo
  • Changed CMRR minimum in High Grade DC Specifications section from 88 dB to 84 dBGo
  • Changed CMRR minimum in High Grade DC specifications over –40°C to +85°C from 84 dB to 83 dBGo
  • Updated Typical Characteristics: VS = ±5 V sectionGo
  • Changed the continuous current rating of the input protection diodes from 30 mA to 10 mAGo

Changes from Revision G (November 2008) to Revision H (April 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from Revision F (March 2006) to Revision G (November 2008)

  • Changed Storage temperature range from –40°C to 125°C to –65°C to 125°CGo
  • Deleted in the DC Performance section: Drift from Input Offset Current specificationsGo

Changes from Revision E (March 2006) to Revision F (November 2008)

  • Added Design-In Tools paragraph and table Go