SBOS799E August   2019  – August 2024 OPA810

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 10 V
    6. 6.6  Electrical Characteristics: 24 V
    7. 6.7  Electrical Characteristics: 5 V
    8. 6.8  Typical Characteristics: VS = 10 V
    9. 6.9  Typical Characteristics: VS = 24 V
    10. 6.10 Typical Characteristics: VS = 5 V
    11. 6.11 Typical Characteristics: ±2.375-V to ±12-V Split Supply
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 OPA810 Architecture
      2. 7.3.2 ESD Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±2.375 V to ±13.5 V)
      2. 7.4.2 Single-Supply Operation (4.75 V to 27 V)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Amplifier Gain Configurations
      2. 8.1.2 Selection of Feedback Resistors
      3. 8.1.3 Noise Analysis and the Effect of Resistor Elements on Total Noise
    2. 8.2 Typical Applications
      1. 8.2.1 Transimpedance Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High-Z Input Data Acquisition Front-End
      3. 8.2.3 Multichannel Sensor Interface
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision D (August 2020) to Revision E (August 2024)

  • Updated Package Information table and added new note 2Go
  • Updated table note 1 in Absolute Maximum Ratings Go
  • Updated CDM specification text in ESD Ratings Go
  • Updated Figure 6-49, Open-Loop Output Impedance vs Frequency, with corrected dataGo

Changes from Revision C (July 2020) to Revision D (August 2020)

  • Deleted selective disclosure header and added top navigation header to page 1Go

Changes from Revision B (June 2020) to Revision C (July 2020)

  • Changed the status of the DCK package From: Preview To: Production Go

Changes from Revision A (December 2019) to Revision B (June 2020)

  • Changed the status of the DBV package From: Preview To: Production Go
  • Added noise corner information to 10 V, 24 V and 5 V electrical characteristics tablesGo
  • Changed offset voltage test conditions for 10 V, 24 V and 5 V supplies for SOIC, SOT23 and SC70 packages.Go
  • Updated Figure 62. Noninverting Amplifier Go

Changes from Revision * (August 2019) to Revision A (December 2019)

  • Changed document status From: Advance Information To: Production Data Go