SBOS867D August   2017  – September 2024 OPA838

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics VS = 5 V
    6. 6.6 Electrical Characteristics VS = 3 V
    7. 6.7 Typical Characteristics: VS = 5 V
    8. 6.8 Typical Characteristics: VS = 3 V
    9. 6.9 Typical Characteristics: Over Supply Range
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Common-Mode Voltage Range
      2. 7.3.2 Output Voltage Range
      3. 7.3.3 Power-Down Operation
      4. 7.3.4 Trade-Offs in Selecting The Feedback Resistor Value
      5. 7.3.5 Driving Capacitive Loads
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 7.4.2 Single-Supply Operation (2.7 V to 5.4 V)
      3. 7.4.3 Power Shutdown Operation
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Noninverting Amplifier
      2. 8.1.2 Inverting Amplifier
      3. 8.1.3 Output DC Error Calculations
      4. 8.1.4 Output Noise Calculations
    2. 8.2 Typical Applications
      1. 8.2.1 High-Gain Differential I/O Designs
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Transimpedance Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ Simulation Software (Free Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DCK|5
  • DCK|6
  • DXB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision C (October 2023) to Revision D (September 2024)

  • Added DXB (X2QFN, 8) package and associated content to data sheetGo

Changes from Revision B (October 2018) to Revision C (October 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Device Information table to Package Information, updated columns, and added note 2Go

Changes from Revision A (February 2018) to Revision B (October 2018)

  • Changed < 5-µA Shutdown Current to < 1-µA Shutdown Current in Features sectionGo
  • Changed value of common-mode and differential-mode input impedance in Electrical Characteristics VS = 5 V and Electrical Characteristics VS = 3 V tablesGo
  • Changed value of power-down quiescent current in Electrical Characteristics: VS = 5 V and Electrical Characteristics VS = 3 V tablesGo
  • Changed 5 µA to 1 µA in Overview section Go
  • Changed standby current from 5 µA to 1 µA in Power-Down Operation sectionGo
  • Changed common-mode input capacitance from 1.3 pF to 1 pF in Trade-Offs in Selecting The Feedback Resistor Value sectionGo
  • Changed 1 + 6.3 / 1.2 = 6.25 V/V, adding the 1.3-pF device common-mode capacitance to 1 + 6 / 1.2 = 6 V/V, adding the 1-pF device common-mode capacitance in Trade-Offs in Selecting The Feedback Resistor Value sectionGo
  • Changed 2 µA to 0.1 µA and 5 µA to 1 µA in last sentence of Power Shutdown Operation sectionGo
  • Changed Power Supply Recommendations and Thermal Notes title to Power Supply Recommendations Go