SLES230A September   2008  – August 2015 PCM2912A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
      1. 7.6.1 ADC Digital Decimation Filter Frequency Response
      2. 7.6.2 ADC Digital High-Pass Filter Frequency Response
      3. 7.6.3 ADC Analog Antialiasing Filter Frequency Response
      4. 7.6.4 DAC Digital Interpolation Filter Frequency Response
      5. 7.6.5 DAC Analog FIR Filter Frequency Response
      6. 7.6.6 DAC Analog Low-Pass Filter Frequency Response
      7. 7.6.7 ADC
      8. 7.6.8 DAC
      9. 7.6.9 Supply Current
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Clock and Reset
      2. 9.3.2  DAC
      3. 9.3.3  ADC
      4. 9.3.4  Microphone Bias
      5. 9.3.5  Microphone Amplifier
      6. 9.3.6  Input PGA
      7. 9.3.7  Sidetone Programmable Attenuator
      8. 9.3.8  Output Programmable Attenuator
      9. 9.3.9  VCOM1 and VCCM2
      10. 9.3.10 Filter Pins
      11. 9.3.11 Interface Sequence
        1. 9.3.11.1 Power-On, Attach, and Play Back Sequence
        2. 9.3.11.2 Play, Stop, and Detach Sequence
        3. 9.3.11.3 Record Sequence
        4. 9.3.11.4 Suspend and Resume Sequence
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 USB Interface
        1. 9.5.1.1 Device Configuration
        2. 9.5.1.2 Interface #0
        3. 9.5.1.3 Interface #1
        4. 9.5.1.4 Interface #2
        5. 9.5.1.5 Endpoints
        6. 9.5.1.6 Internal Regulator
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.