SBOS424C March   2008  – November 2015 PGA112 , PGA113 , PGA116 , PGA117

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = AVDD = DVDD = 5 V
    6. 7.6 SPI Timing: VS = AVDD = DVDD = 2.2 V to 5 V
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Serial Interface Information
      1. 8.6.1 Serial Digital Interface: SPI Modes
      2. 8.6.2 Serial Digital Interface: SPI Daisy-Chain Communications
      3. 8.6.3 SPI Serial Interface
      4. 8.6.4 SPI Commands
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Op Amp: Input Stage
      2. 9.1.2 Op Amp: General Gain Equations
      3. 9.1.3 Op Amp: Frequency Response Versus Gain
        1. 9.1.3.1 Example:
      4. 9.1.4 Analog MUX
      5. 9.1.5 System Calibration Using The PGA
      6. 9.1.6 Driving and Interfacing to ADCs
      7. 9.1.7 Power Supplies
      8. 9.1.8 Shutdown and Power-On-Reset (POR)
      9. 9.1.9 Typical Connections: PGA116, PGA117 (TSSOP-20)
    2. 9.2 Typical Applications
      1. 9.2.1 Bipolar Input to Single-Supply Scaling
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Typical Application: General-Purpose Input Scaling
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 High Gain and Wide Bandwidth Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

  • Shelf-Life Evaluation of Lead-Free Component Finishes, SZZA046.
  • PGA112/113EVM Users Guide, SBOU073.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 13. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
PGA112 Click here Click here Click here Click here Click here
PGA113 Click here Click here Click here Click here Click here
PGA116 Click here Click here Click here Click here Click here
PGA117 Click here Click here Click here Click here Click here

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.