SBASB64 August   2024 PGA300

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Documentation Support
      1. 4.1.1 Related Documentation
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  6. 5Mechanical, Packaging, and Orderable Information
    1. 5.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The PGA300 provides an interface for piezoresistive and strain-gauge pressure-sense elements. The device is a full system-on-chip (SoC) solution that incorporates a programmable analog front-end (AFE), ADC, and digital signal processing that enable direct connection to the sense element. Further, the PGA300 includes integrated voltage regulators and an oscillator, thus minimizing the number of external components. The device achieves high accuracy by employing third-order temperature and nonlinearity compensation. External communication is achieved by using a one-wire serial interface (OWI) through the power-supply pin to simplify the system calibration process. An Integrated DAC supports absolute-voltage, ratiometric-voltage, and 4mA to 20mA current-loop outputs.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
PGA300 RHH (VQFN, 36) 6mm × 6mm
(1) For more information, see the Mechanical, Packaging, and Orderable Information.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
PGA300 PGA300 Simplified Block Diagram PGA300 Simplified Block Diagram