SBASB64
August 2024
PGA300
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device and Documentation Support
4.1
Documentation Support
4.1.1
Related Documentation
4.2
Receiving Notification of Documentation Updates
4.3
Support Resources
4.4
Trademarks
4.5
Electrostatic Discharge Caution
4.6
Glossary
5
Mechanical, Packaging, and Orderable Information
5.1
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
RHH|36
MPQF144E
Thermal pad, mechanical data (Package|Pins)
1
Features
Analog features:
Analog front-end for resistive bridge sensors
Accommodates sensor sensitivities from 1mV/V to 135mV/V
On-chip temperature sensor
Programmable gain
16-bit sigma-delta analog-to-digital converter for signal channel
16-bit sigma-delta analog-to-digital converter for temperature channel
14-bit output DAC
Digital features:
<0.1% FSO accuracy across temperature
System response time: <220µs
Third-order temperature and nonlinearity compensation
Diagnostic functions
Integrated EEPROM for device operation, calibration data, and user data
Peripheral features:
One-wire interface enables communication through the power-supply pin
Current-loop output: 4mA to 20mA
Ratiometric and absolute voltage output
Power supply:
On-chip power management accepts wide power-supply voltage from 3.3V to 30V
Integrated reverse voltage protection circuit
Industrial temperature range: –40°C to +150°C