SBASB64 August   2024 PGA300

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Documentation Support
      1. 4.1.1 Related Documentation
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  6. 5Mechanical, Packaging, and Orderable Information
    1. 5.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Analog features:
    • Analog front-end for resistive bridge sensors
    • Accommodates sensor sensitivities from 1mV/V to 135mV/V
    • On-chip temperature sensor
    • Programmable gain
    • 16-bit sigma-delta analog-to-digital converter for signal channel
    • 16-bit sigma-delta analog-to-digital converter for temperature channel
    • 14-bit output DAC
  • Digital features:
    • <0.1% FSO accuracy across temperature
    • System response time: <220µs
    • Third-order temperature and nonlinearity compensation
    • Diagnostic functions
    • Integrated EEPROM for device operation, calibration data, and user data
  • Peripheral features:
    • One-wire interface enables communication through the power-supply pin
    • Current-loop output: 4mA to 20mA
    • Ratiometric and absolute voltage output
  • Power supply:
    • On-chip power management accepts wide power-supply voltage from 3.3V to 30V
    • Integrated reverse voltage protection circuit
  • Industrial temperature range: –40°C to +150°C