SLDS258 April   2019 PGA900

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      PGA900 Simplified Block Diagram
  4. 4Device and Documentation Support
    1. 4.1 Documentation Support
      1. 4.1.1 Related Documentation
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Community Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  5. 5Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High accuracy, low noise, low power, small size resistive sensing signal conditioner
  • User-programmable temperature and nonlinearity compensation
  • On-chip ARM®Cortex® M0 microprocessor allows users to develop and implement calibration software
  • One-wire interface enables the communication through power supply pin without using additional lines
  • On-chip power management accepts wide power supply voltage from 3.3 V to 30 V
  • Operating temperature range: –40°C to +150°C
  • Memory:
    • 8-kB software memory
    • 128 bytes EEPROM
    • 1-kB data SRAM
  • Accommodates sensor sensitivities from 1 mV/V to 135 mV/V
  • Two individual analog-front end (AFE) chains, each including:
    • Low-noise programmable gain amplifier
    • 24-bit sigma-delta analog-to-digital converter
  • Built-in internal temperature sensor with option to use external temperature sensor
  • 14-bit DAC with programmable gain amplifier
  • Output options:
    • Ratiometric and absolute voltage output
    • 4- to 20-mA current loop interface
    • One-wire interface (OWI) over power line
    • PWM output
    • Serial peripheral interface (SPI)
    • Inter-integrated circuit (I2C)
  • Depletion MOSFET gate driver
  • Diagnostic functions