SNAS795A February   2020  – July 2020 REF4132-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Dropout vs. Current Load Over Temperature
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1      Absolute Maximum Ratings
    2. 7.2      ESD Ratings
    3. 7.3      Recommended Operating Conditions
    4. 7.4      Thermal Information
    5. Table 1. Electrical Characteristics
    6. 7.5      Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Long-Term Stability
    3. 8.3 Thermal Hysteresis
    4. 8.4 Power Dissipation
    5. 8.5 Noise Performance
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Voltage
      2. 9.3.2 Low Temperature Drift
      3. 9.3.3 Load Current
    4. 9.4 Device Functional Modes
      1. 9.4.1 EN Pin
      2. 9.4.2 Negative Reference Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Basic Voltage Reference Connection
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input and Output Capacitors
        2. 10.2.2.2 VIN Slew Rate Considerations
        3. 10.2.2.3 Shutdown/Enable Feature
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C, VIN = VEN = 5 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted)
REF4132-Q1 D001_SBAS804.gifFigure 1. Temperature Drift
REF4132-Q1 G001_REF4132_TempCo.gif
Figure 3. Output Voltage Accuracy vs Temperature
REF4132-Q1 G017_REF4132_Isc.gif
Figure 5. Short Circuit Current
REF4132-Q1 G003_REF4132_LineReg.gif
Figure 7. Line Regulation
REF4132-Q1 G018_noisespec.gif
Figure 9. Noise Performance 10 Hz to 10 kHz
REF4132-Q1 G006_REF4132_LoadTran2.gif
Figure 11. Load Transient
REF4132-Q1 G008_REF4132_LoadTran4.gif
Figure 13. Load Transient
REF4132-Q1 G011_REF4132_ShutdownIq.gif
Figure 15. Quiescent Current Shutdown Mode
REF4132-Q1 D0162_SBAS804.gif
Figure 17. Thermal Hysteresis Distribution (Cycle 2)
REF4132-Q1 G012_REF4132_TurnOn.gif
Figure 19. Turnon Time (Enable)
REF4132-Q1 D003_VinvsIq.gif
Figure 2. VIN vs IQ over Temperature
REF4132-Q1 G002_REF4132_IqVsTemp.gif
Figure 4. Quiescent Current vs Temperature
REF4132-Q1 D005_SBAS804.gif
Figure 6. Power-Supply Rejection Ratio vs Frequency
REF4132-Q1 G004_REF4132_LoadReg.gif
Figure 8. Load Regulation Sourcing
REF4132-Q1 G005_REF4132_LoadTran1.gif
Figure 10. Load Transient
REF4132-Q1 G007_REF4132_LoadTran3.gif
Figure 12. Load Transient
REF4132-Q1 D001_linetrans.gif
Figure 14. Line Transient
REF4132-Q1 D0161_SBAS804.gif
Figure 16. Thermal Hysteresis Distribution (Cycle 1)
REF4132-Q1 D017_SBAS804.gif
Refer to Solder Heat Shift for more information
Figure 18. Solder Heat Shift Distribution
REF4132-Q1 G013_REF4132_LTD1k.gif
Figure 20. Long Term Stability - 1000 hours (VREF)