SBOS410L June   2007  – October 2024 REF5010 , REF5020 , REF5025 , REF5030 , REF5040 , REF5045 , REF5050

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics REF50
    6. 6.6 Electrical Characteristics REF50EI
    7. 6.7 Typical Characteristics: REF50xxI, REF50xxAI
    8. 6.8 Typical Characteristics: REF50xxEI
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Monitoring
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Thermal Hysteresis
      4. 8.3.4 Noise Performance
      5. 8.3.5 Long-Term Stability
      6. 8.3.6 Output Adjustment Using the TRIM/NR Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Basic Connections
      2. 8.4.2 Supply Voltage
      3. 8.4.3 Negative Reference Voltage
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 16-Bit, 250-KSPS Data Acquisition System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

REF50xxI, REF50xxAI

  • Place the power-supply bypass capacitor as closely as possible to the supply and ground pins. The recommended value of this bypass capacitor is from 1μF to 10μF. If necessary, additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.
  • Place a 1μF noise filtering capacitor between the NR pin and ground.
  • The output must be decoupled with a 1μF to 50μF capacitor. A resistor in series with the output capacitor is optional. For better noise performance, the recommended ESR on the output capacitor is from 1Ω to 1.5Ω.
  • A high-frequency, 1μF capacitor can be added in parallel between the output and ground to filter noise and help with switching loads as data converters.

REF50xxEI

  • Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended value of this bypass capacitor is from 0.1μF to 10μF. If necessary, additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies. The smallest capacitor must be placed closest to the device
  • Place a 0.1μF to 1μF class 1 noise filtering capacitor between the NR pin and ground
  • The output must be decoupled with a 1μF to 100μF low ESR (maximum 1 Ω) capacitor.