SBOS410L June   2007  – October 2024 REF5010 , REF5020 , REF5025 , REF5030 , REF5040 , REF5045 , REF5050

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics REF50
    6. 6.6 Electrical Characteristics REF50EI
    7. 6.7 Typical Characteristics: REF50xxI, REF50xxAI
    8. 6.8 Typical Characteristics: REF50xxEI
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Monitoring
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Thermal Hysteresis
      4. 8.3.4 Noise Performance
      5. 8.3.5 Long-Term Stability
      6. 8.3.6 Output Adjustment Using the TRIM/NR Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Basic Connections
      2. 8.4.2 Supply Voltage
      3. 8.4.3 Negative Reference Voltage
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 16-Bit, 250-KSPS Data Acquisition System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

8.3.1 Temperature Monitoring

The temperature output terminal (TEMP, pin 3) provides a temperature-dependent voltage output with approximately 60kΩ source impedance. As illustrated in Figure 6-8, the output voltage follows the nominal relationship:

Equation 1. REF50xxI, REF50xxAI: VTEMP PIN = 509mV + 2.64 × T(°C)
Equation 2. REF50xxEI: VTEMP PIN = 625mV + 2.64 × T(°C)

This pin indicates general chip temperature, accurate to approximately ±15°C. Although not generally suitable for accurate temperature measurements, this pin can be used to indicate temperature changes or for temperature compensation of analog circuitry. A temperature change of 30°C corresponds to an approximate 79mV change in voltage at the TEMP pin.

The TEMP pin has high-output impedance (see Section 8.2). Loading this pin with a low-impedance circuit induces a measurement error; however, this pin does not have any effect on VOUT accuracy.

To avoid errors caused by low-impedance loading, buffer the TEMP pin output with a suitable low-temperature drift op amp, such as the OPA333, OPA335, or OPA376, as shown in Figure 8-3.

REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 Buffering the TEMP Pin OutputFigure 8-3 Buffering the TEMP Pin Output