SLPS755A October   2023  – December 2023 RES11A-Q1

ADVMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 AEC-Q200 Qualification Testing
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 DC Measurement Configurations
    2. 6.2 AC Measurement Configurations
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ratiometric Matching
      2. 7.3.2 Ratiometric Drift
      3. 7.3.3 Predictable Voltage Coefficient
      4. 7.3.4 Ultra-Low Noise
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Discrete Difference Amplifier
        1. 8.1.1.1 Difference-Amplifier Common-Mode Rejection Analysis
      2. 8.1.2 Discrete Instrumentation Amplifiers
        1. 8.1.2.1 Instrumentation Amplifier Common-Mode Rejection Analysis
      3. 8.1.3 Fully Differential Amplifier
    2. 8.2 Typical Application
      1. 8.2.1 Common-Mode Shifting Input Stage
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 TI Reference Designs
        4. 9.1.1.4 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Ratiometric Drift

The ratiometric matching of the RES11A-Q1 provides a benefit not just for initial conditions, but also when considering parametric drift. The resistors must be considered individually, in absolute terms, and ratiometrically to each other, in matched terms. The absolute temperature coefficients of each resistor show strong correlation, with the coefficient of RIN1 comparable to that of RIN2 and the coefficient of RG1 comparable to that of RG2. The absolute temperature coefficient (in Ω/°C) of each RG is approximately Gnom times greater than that of the comparable RIN; hence, the normalized absolute temperature coefficient (in ppm/°C) of every resistor is about the same.

Because the resistors of the RES11A-Q1 are interdigitated, and occupy a small footprint, the die temperature of the device is effectively common to each of the four resistors. As the temperature changes, each resistor experiences a similar temperature rise. Because the resistors have very similar temperature coefficients, the ratio of RG to RIN is well preserved. For example, the RES11A40-Q1 has a typical absolute temperature coefficient of approximately 18 ppm/°C for RIN or RG. When considered in ratiometric terms, the typical temperature coefficient of tD1 or tD2 is –0.2 ppm/°C, and the temperature coefficient of tM is 0.05 ppm/°C.