SCHS367C October   2008  – April 2022 SN54AC00-SP

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Bare Die Information
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics, VCC = 3.3 V
    6. 6.6 Switching Characteristics, VCC = 5 V
    7. 6.7 Operating Characteristics
  7. 7Parameter Measurement Information
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1)(2)SN54AC00-SPUNIT
JW
14 PINS14 PINS
RθJAJunction-to-ambient thermal resistance83.1125.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance26.630.85
RθJBJunction-to-board thermal resistance47.943.4
ψJTJunction-to-top characterization parameterN/AN/A
ψJBJunction-to-board characterization parameterN/AN/A
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7 and Mil Std 883 method 1012.1 (see www.JEDEC.org).