SCBS019D September   1988  – February 2021 SN74BCT374

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions (1)
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bipolar Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
        1. 9.2.2.1 Power Considerations
        2. 9.2.2.2 Output Considerations
        3. 9.2.2.3 Input Considerations
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|20
  • J|20
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74BCT374 UNIT
DB (SSOP) DW (SOIC) N (PDIP) NS (SO)
20 PINS 20 PINS 20 PINS 20 PINS
R θJA Junction-to-ambient thermal resistance 84.4 73.4 59.7 71.2 °C/W
R θJB Junction-to-board thermal resistance 40.1 41.9 40.6 36.2 °C/W
ψ JT Junction-to-top characterization parameter 6.2 14.6 24.9 7.6 °C/W
ψ JB Junction-to-board characterization parameter 39.5 41.4 40.3 35.9 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 36.8 38.8 50.0 34.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.