SCBS019D September   1988  – February 2021 SN74BCT374

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions (1)
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bipolar Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
        1. 9.2.2.1 Power Considerations
        2. 9.2.2.2 Output Considerations
        3. 9.2.2.3 Input Considerations
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|20
  • J|20
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (March 2003) to Revision D (February 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added new applications to the Applications sectionGo
  • Removed Ordering Information and Function tables from the Description sectionGo
  • Added the Device Information table to the Description sectionGo
  • Moved package thermal impedance, ΘJA for the DW, N, and NS packages to Section 6.4 Go
  • Added ESD Ratings sectionGo
  • Added Thermal Information sectionGo
  • Changed IOS(min) value From: –100 mA To: –50 mA Go
  • Added Timing Requirements, Switching Characteristics, and Typical Characteristics sectionsGo
  • Added Detailed Description sectionGo
  • Added Application and Implementation sectionGo
  • Added Power Supply Recommendations and Layout sectionsGo

Changes from Revision B (April 1994) to Revision C (March 2003)

  • Added Ordering Information table to the Description sectionGo
  • Added package thermal impedance, ΘJA for the DW, N, and NS packagesGo

Changes from Revision A (November 1993) to Revision B (April 1994)

  • First public release of production data sheet.Go