SCLS299F January   1996  – June 2022 SN54HC175 , SN74HC175

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|16
  • J|16
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 Recommended Operating Conditions(1)

SN54HC175 SN74HC175 UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 2 5 6 2 5 6 V
VIH High-level input voltage VCC = 2 V 1.5 1.5

V
VCC = 4.5 V 3.15 3.15
VCC = 6 V 4.2 4.2
VIL Low-level input voltage VCC = 2 V 0.5 0.5 V
VCC = 4.5 V 1.35 1.35
VCC = 6 V 1.8 1.8
VI Input voltage 0 VCC 0 VCC V
VO Output voltage 0 VCC 0 VCC V
tt Input transition rise/fall time VCC = 2 V 1000 1000 ns
VCC = 4.5 V 500 500
VCC = 6 V 400 400
TA Operating free-air temperature −55 125 −40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.