SCLS299F January   1996  – June 2022 SN54HC175 , SN74HC175

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|16
  • J|16
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20210923-SS0I-2VV0-5PBG-3DHGBFX6LBRC-low.pngJ, W, D, DB, N, NS, or PW Package
16-Pin CDIP, CFP, SOIC, SSOP, PDIP, SO, or TSSOP
Top View
GUID-20210923-SS0I-LGGK-JQC1-X6K4ZCPVL70H-low.png

NC - No internal connection

FK Package
20-Pin LCCC
Top View