SCLS299F January   1996  – June 2022 SN54HC175 , SN74HC175

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|16
  • J|16
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (February 2022) to Revision F (June 2022)

  • Junction-to-ambient thermal resistance values increased. D was 73 is now 117.2, DB was 67 is now 102.7, N was 82 is now 60.5, NS was 64 is now 88.6, PW was 108 is now 137.5Go

Changes from Revision D (September 2003) to Revision E (February 2022)

  • Updated the numbering, formatting, tables, figures, and cross-references throughout the doucment to reflect modern data sheet standardsGo