SCAS292S January   1993  – December 2024 SN54LVC157A , SN74LVC157A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions, SN54LVC157A
    4. 4.4  Recommended Operating Conditions, SN74LVC157A
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics, SN54LVC157A
    7. 4.7  Electrical Characteristics, SN74LVC157A
    8. 4.8  Switching Characteristics, SN54LVC157A
    9. 4.9  Switching Characteristics, SN74LVC157A
    10. 4.10 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision R (May 2024) to Revision S (December 2024)

  • Updated RθJA values: D = 73 to 118.1, PW = 108 to 141.8, RGY = 39 to 87.1; Updated D, PW, and RGY packages for RθJC(top), RθJB, ΨJT, ΨJB, and RθJC(bot), all values in °C/WGo

Changes from Revision Q (December 2010) to Revision R (May 2024)

  • Added BQA package to Package Information table, Pin Configuration and Functions section, and Thermal Information tableGo
  • Added Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device Functional Modes,Application and Implementation section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted machine model from Features sectionGo