SLLSES6C February   2016  – December 2021 SN65DP141

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Switching Characteristics, I2C Interface
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DC and AC Independent Gain Control
      2. 8.3.2 Two-Wire Serial Interface and Control Logic
      3. 8.3.3 Bus Idle
      4. 8.3.4 Start Data Transfer
      5. 8.3.5 Stop Data Transfer
      6. 8.3.6 Data Transfer
      7. 8.3.7 Acknowledge
    4. 8.4 Device Functional Modes
      1. 8.4.1 TRACE and CABLE Equalization Modes
      2. 8.4.2 Control Modes
      3. 8.4.3 GPIO MODE
      4. 8.4.4 I2C Mode
    5. 8.5 Register Maps
      1. 8.5.1  Register 0x00 (General Device Settings) (offset = 00000000) [reset = 00000000]
      2. 8.5.2  Register 0x01 (Channel Enable) (offset = 00000000) [reset = 00000000]
      3. 8.5.3  Register 0x02 (Channel 0 Control Settings) (offset = 00000000) [reset = 00000000]
      4. 8.5.4  Register 0x03 (Channel 0 Enable Settings) (offset = 00000000) [reset = 00000000]
      5. 8.5.5  Register 0x05 (Channel 1 Control Settings) (offset = 00000000) [reset = 00000000]
      6. 8.5.6  Register 0x06 (Channel 1 Enable Settings) (offset = 00000000) [reset = 00000000]
      7. 8.5.7  Register 0x08 (Channel 2 Control Settings) (offset = 00000000) [reset = 00000000]
      8. 8.5.8  Register 0x09 (Channel 2 Enable Settings) (offset = 00000000) [reset = 00000000]
      9. 8.5.9  Register 0x0B (Channel 3 Control Settings) (offset = 00000000) [reset = 00000000]
      10. 8.5.10 Register 0x0C (Channel 3 Control Settings) (offset = 00000000) [reset = 00000000]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN65DP141 UNIT
RLJ (WQFN)
38 PINS
RθJA Junction-to-ambient thermal resistance 36.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 22.3 °C/W
RθJB Junction-to-board thermal resistance 10.7 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 10.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.